Resistive memory array using P-I-N diode select device and methods of fabrication thereof
An electronic structure includes a resistive memory device, and a P-I-N diode in operative association with the resistive memory device. A plurality of such electronic structures are used in a resistive memory array, with the P-I-N diodes functioning as select devices in the array. Methods are provided for fabricating such resistive memory device-P-I-N diode structures.
1. A method of forming regions of a P-I-N diode comprising:
providing a semiconductor body;
providing first and second doped bodies adjacent and running along opposite sides of the semiconductor body, the first and second doped bodies containing a dopant of a first selected conductivity type;
providing a third doped body overlying the semiconductor body, the third doped body containing a dopant of a second selected conductivity type opposite the first selected conductivity type;
diffusing dopant of the first selected conductivity type from the first and second doped bodies into the semiconductor body to form a first region of the first selected conductivity type in the semiconductor body, the first region of the first selected conductivity type in the semiconductor body making up part of a P-I-N diode;
diffusing dopant of the second selected conductivity type from the third doped body into the semiconductor body to form a region of the second selected conductivity type in the semiconductor body, the region of the second selected conductivity type in the semiconductor body making up part of a P-I-N diode; and
diffusing dopant of the first selected conductivity type from the first and second doped bodies into the semiconductor body to form the first region and a second region of the first selected conductivity type in the semiconductor body, the second region making up part of a P-I-N diode.
2. The method of claim 1 wherein the first region of the first selected conductivity type and the region of the second selected conductivity type are formed at different times in the semiconductor body.
3. The method of claim 1 wherein an intrinsic region is provided between the first region of the first selected conductivity type and the region of the second selected conductivity type.
4. The method of claim 1 wherein the semiconductor body comprises monocrystalline material.
5. The method of claim 4 wherein the semiconductor body comprises epitaxial material.
6. The method of claim 1 and further comprising providing a conductor in contact with the first region of the selected conductivity type in the semiconductor body making up part of a P-I-N diode.
7. The method of claim 6 wherein the conductor is a silicide.
8. The method of claim 1 and further comprising:
providing a second semiconductor body, the second doped body and a third doped body being adjacent the second semiconductor body, wherein the second and third doped bodies run along opposite sides of the second semiconductor body; and
diffusing dopant of the first selected conductivity type from the second and third doped bodies into the second semiconductor body to form a first region of the first selected conductivity type in the second semiconductor body, the first region of the first selected conductivity type in the second semiconductor body making up part of a P-I-N diode.
9. The method of claim 8 wherein the second semiconductor body comprises monocrystalline material.
10. The method of claim 9 wherein the second semiconductor body comprises epitaxial material.
11. The method of claim 8 and further comprising
providing a conductor in contact with a region of the first selected conductivity type in the second semiconductor body making up part of a P-I-N diode.
12. The method of claim 11 wherein the conductor is a silicide.
13. The method of claim 1 wherein an intrinsic region is provided between the first and second regions of the first selected conductivity type.
14. The method of claim 13 wherein the first and second regions of the first selected conductivity type are formed simultaneously in the semiconductor body.
15. The method of claim 13 wherein the semiconductor body comprises monocrystalline material.
16. The method of claim 15 wherein the semiconductor body comprises epitaxial material.
17. The method of claim 1 and further comprising providing a conductor in contact with a region of the first selected conductivity type in the semiconductor body making up part of a P-I-N diode.
18. The method of claim 17 wherein the conductor is a silicide.
19. The method of claim 1 and further comprising forming a resistive memory device associated with the resulting structure.
20. The method of claim 19 wherein the resistive memory device comprises a first electrode, an insulating layer on and in contact with the first electrode, and a second electrode on and in contact with the insulating layer.
21. The method of claim 1 and further comprising said P-I-N diode incorporated in a system.
22. The method of claim 21 wherein the system is selected from the group consisting of a hand-held device, a vehicle, and a computer.
23. A method of forming a P-I-N diode comprising:
providing a first and second semiconductor body;
providing first and second doped bodies adjacent the first semiconductor body and a third doped body and the second doped body adjacent the second semiconductor body, the first, second, and third doped bodies containing a dopant of a first selected conductivity type, wherein the first and second doped bodies run along opposite sides of the first semiconductor body, and wherein the second and third doped bodies run along opposite sides of the second semiconductor body; and
diffusing dopant of the first selected conductivity type from the first and second doped bodies and the second and third doped bodies into the first and second semiconductor bodies, respectively, to form a region of the first selected conductivity type in the first and second semiconductor bodies, the regions of the first selected conductivity type in the first and second semiconductor bodies each making up part of a P-I-N diode.
24. The method of claim 23 , further comprising:
providing a third doped body overlying the first semiconductor body and a fourth doped body overlying the second semiconductor body, the third and fourth doped bodies each containing a dopant of a second selected conductivity type opposite the first selected conductivity type; and
diffusing dopant of the second selected conductivity type from the third and fourth doped bodies into the first and second semiconductor bodies, respectively, to form a region of the second selected conductivity type in the first and second semiconductor bodies, the regions of the second selected conductivity type in the first and second semiconductor bodies each making up part of a P-I-N diode.