IP Library Granted Patent US 8,365,044
Granted Patent B2
US 8,365,044 · App. 11/738,827 · Granted Jan 29, 2013

Memory device with error correction based on automatic logic inversion

Inventors: Dennis E. Dudeck (Hazleton, PA); Donald Albert Evans (Lancaster, OH); Hai Quang Pham (Hatfield, PA); Wayne E. Werner (Coopersburg, PA); Ronald James Wozniak (Allentown, PA)
Assignee: Agere Systems Inc.
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Quick Facts
Patent No.
US 8,365,044
App. No.
11/738,827
Granted
Jan 29, 2013
Kind
B2
Abstract

A memory device comprises a memory array and error correction circuitry coupled to the memory array. The error correction circuitry is configured to identify, in a data word retrieved from the memory array, at least one bit position corresponding to a predetermined defect location in the memory array, and to generate a corrected data word by automatically inverting a logic value at the identified bit position. This automatic logic inversion approach is particularly well suited for use in correcting output data errors associated with via defects and weak bit defects in high-density ROM devices.

Claims (57)

1. A memory device comprising:

a memory array comprising a plurality of memory cells configured to store data; and

error correction circuitry coupled to the memory array and configured to identify, in a data word retrieved from the memory array, at least one bit position corresponding to at least one predetermined defect location in the memory array, and to generate a corrected data word by automatically inverting a logic value at the at least one bit position corresponding to the predetermined defect location in the memory array;

wherein the predetermined defect location in the memory array is determined to be defective before the data word is retrieved from the memory array;

wherein the error correction circuitry is configured to identify said at least one bit position corresponding to a predetermined defect location in the memory array by:

determining at least one stored defective word address identifying a word of the memory array comprising the predetermined defect location; and

determining at least one stored output address corresponding to the at least one stored defective word address; and

wherein determining the at least one stored defective word address comprises comparing a read address used to retrieve the data word from the memory array to the at least one stored defective word address; and

wherein the at least one stored output address identifies the at least one bit position corresponding to the predetermined defect location within the word identified by the corresponding at least one stored defective word address.

2. The memory device of claim 1 , wherein the error correction circuitry comprises a plurality of comparators configured to compare the read address to respective ones of a plurality of stored defective word addresses identifying respective words of the memory array each comprising one or more predetermined defect locations, each of the plurality of comparators corresponding to a different one of the plurality of stored defective word addresses.

3. The memory device of claim 2 wherein the error correction circuitry further comprises:

an address bus multiplexer having a first set of inputs coupled to respective outputs of the comparators and a second set of inputs configured to receive respective ones of a plurality of stored defective output addresses, the address bus multiplexer being configured to select one of the plurality of defective output addresses based on a match between the read address and a corresponding one of the defective word addresses;

an output decoder which receives as input from the address bus multiplexer the selected one of the plurality of defective output addresses, the output decoder being configured to identify based on the selected one of the defective output addresses said at least one bit position corresponding to a predetermined defect location in the memory array and to automatically invert a logic value at the at least one bit position corresponding to the predetermined defect location in the memory array; and

a logic circuit having an input coupled to an output of the output decoder, said logic circuit being configured to combine an output of the output decoder with the data word retrieved from the memory array to generate the corrected data word;

wherein each of the plurality of stored defective output addresses corresponds to a respective one of the plurality of stored defective word addresses and identifies at least one bit position, within the corresponding one of the plurality of stored defective word addresses, which corresponds to the predetermined defect location in the memory array.

4. The memory device of claim 3 wherein the logic circuit comprises an OR gate having a first input coupled to an output of the memory array and a second input coupled to an output of the output decoder.

5. The memory device of claim 3 wherein the logic circuit comprises an AND gate having a non-inverting input coupled to an output of the memory array and an inverting input coupled to an output of the output decoder.

6. The memory device of claim 1 wherein the error correction circuitry is configured to correct a single-bit error in each of a plurality of data words of the memory array.

7. The memory device of claim 1 wherein the error correction circuitry is configured to correct a multiple-bit error in at least one data word of the memory array.

8. The memory device of claim 1 wherein said predetermined defect comprises a via defect.

9. The memory device of claim 1 wherein said predetermined defect comprises a weak bit defect.

10. The memory device of claim 1 wherein the memory device comprises a read-only memory.

11. The memory device of claim 1 wherein the memory device comprises a stand-alone memory device.

12. The memory device of claim 1 wherein the memory device comprises an embedded memory device.

13. The memory device of claim 1 wherein the error correction circuitry operates without reliance on one or more redundant memory elements and without reliance on one or more error correction codes.

14. An integrated circuit comprising:

a memory device; and

additional circuitry coupled to the memory device;

said memory device comprising:

a memory array having a plurality of memory cells configured to store data; and

error correction circuitry coupled to the memory array and configured to identify, in a data word retrieved from the memory array, at least one bit position corresponding to a predetermined defect location in the memory array, and to generate a corrected data word by automatically inverting a logic value at the at least one bit position corresponding to the predetermined defect location in the memory array;

wherein the predetermined defect location in the memory array is determined to be defective before the data word is retrieved from the memory array;

wherein the error correction circuitry is configured to identify said at least one bit position corresponding to a predetermined defect location in the memory array by:

determining at least one stored defective word address identifying a word of the memory array comprising the predetermined defect location; and

determining at least one stored output address corresponding to the at least one stored defective word address; and

wherein determining the at least one stored defective word address comprises comparing a read address used to retrieve the data word from the memory array to the at least one stored defective word address; and

wherein the at least one stored output address identifies the at least one bit position corresponding to the predetermined defect location within the word identified by the corresponding at least one stored defective word address.

15. A method for correcting one or more likely bit errors in an output data word of a memory device, the memory device comprising a memory array having a plurality of memory cells configured to store data, the method comprising the steps of:

retrieving a data word from the memory array;

identifying at least one bit position in the retrieved data word corresponding to a predetermined defect location in the memory array; and

generating a corrected data word by automatically inverting a logic value at the at least one bit position corresponding to the predetermined defect location in the memory array;

wherein the predetermined defect location in the memory array is determined to be defective before the data word is retrieved from the memory array;

wherein the step of identifying said at least one bit position corresponding to a predetermined defect location in the memory array further comprises the steps of:

determining at least one stored defective word address identifying a word of the memory array comprising the predetermined defect location; and

determining at least one stored output address corresponding to the at least one stored defective word address; and

wherein determining the at least one stored defective word address comprises comparing a read address used to retrieve the data word from the memory array to the at least one stored defective word address; and

wherein the at least one stored output address identifies the at least one bit position corresponding to the predetermined defect location within the word identified by the corresponding at least one stored defective word address.

16. The method of claim 15 wherein the comparing step further comprises comparing the read address to respective ones of a plurality of stored defective word addresses identifying respective words of the memory array each comprising one or more predetermined defect locations.

17. The method of claim 16 wherein the identifying step further comprises selecting one of a plurality of defective output addresses based on a match between the read address and a corresponding one of the defective word addresses.

18. The method of claim 17 wherein the identifying step further comprises identifying based on the selected one of the defective output addresses said at least one bit position corresponding to a predetermined defect location in the memory array.

19. The method of claim 15 wherein the generating step comprises combining an output of an output decoder with the data word retrieved from the memory array to generate the corrected data word.

20. The method of claim 19 wherein the combining step further comprises:

applying an output of the memory array to a first input of an OR gate; and

applying an output of the output decoder to a second input of the OR gate.

21. The method of claim 19 wherein the combining step further comprises:

applying an output of the memory array to a non-inverting input of an AND gate; and

applying an output of the output decoder to an inverting input of the AND gate.

Assignments (7)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
CERTIFICATE OF CONVERSION Recorded Aug 29, 2014
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 033663/0948 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2007
From: DUDECK, DENNIS E.; EVANS, DONALD ALBERT; PHAM, HAI QUANG; WERNER, WAYNE E.; WOZNIAK, RONALD JAMES
To: AGERE SYSTEMS INC.
Reel/Frame 019195/0200 →
Continuity (1)
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