Semiconductor structure with high breakdown voltage and resistance
View Patent ↗A semiconductor structure with high breakdown voltage and high resistance and method for manufacturing the same. The semiconductor structure at least comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate; two first wells having the first conductive type and formed within the deep well; a second well having the first conductive type and formed between the two first wells within the deep well, and an implant dosage of the second well lighter than an implant dosage of each of the two first wells; and two first doping regions having the first conductive type and respectively formed within the two first wells.
1. A semiconductor structure, at least comprising:
a substrate having a first conductive type;
a deep well having a second conductive type, extending down from a surface of the substrate;
two first wells having the first conductive type, extending down from the surface of the substrate and formed within the deep well;
a second well having the first conductive type, extending down from the surface of the substrate and formed between the two first wells within the deep well, and an implant dosage of the second well lighter than an implant dosage of each of the two first wells, wherein the second well and the two first wells have the same well depths;
two first doping regions having the first conductive type, respectively formed within the two first wells and spaced apart from the second well, wherein the two first doping regions extend down from the surface of the substrate and an implant dosage of each of the two first doping regions is higher than the implant dosage of each of the two first wells; and
two third wells having the first conductive type, extending down from the surface of the substrate and respectively contacting two outer side surfaces of the deep well.
2. The semiconductor structure according to claim 1 , further comprising: a second doping region having the second conductive type, extending down from the surface of the substrate and formed within the deep well, and the second doping region being isolated from the two first wells.
3. The semiconductor structure according to claim 2 , further comprising:
a high voltage end, connected to the second doping region and one of the two first doping regions; and
a low voltage end, connected to the other first doping region.
4. The semiconductor structure according to claim 2 , wherein the second doping region is spaced from one of the two first wells at a distance of about 1 μm to about 3 μm.
5. The semiconductor structure according to claim 2 , wherein the second doping region is isolated from the two third wells and the substrate by the deep well.
6. The semiconductor structure according to claim 2 , wherein the substrate is a P-substrate, the deep well is a N-deep well, the two first wells and the two third wells are a plurality of P-wells, the second well is a P-type body, the two first doping regions are P+ doping regions, and the second doping region is n+ doping region.
7. The semiconductor structure according to claim 2 , wherein each of the two first wells and the two third wells has a depth of about 1 μm to about 5 μm.
8. The semiconductor structure according to claim 2 , wherein the implant dosage of the second well is lighter than an implant dosage of each of the two third wells.
9. The semiconductor structure according to claim 1 , wherein the two first wells contact two sides of the second well respectively.
10. The semiconductor structure according to claim 1 , wherein the deep well has a depth of about 2 μm to about 10 μm.
11. The semiconductor structure according to claim 1 , wherein the second well has a depth of about 1 μm to about 5 μm.
12. The semiconductor structure according to claim 1 , wherein one of the two first doping regions is spaced from the second well at a distance of about 1 μm to about 3 μm.