Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
View Patent ↗An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.
1. An electronic device comprising:
a substrate having a plurality of wiring layers;
an electronic element mounted above the substrate;
an encapsulation member covered over the electronic element and a part of the substrate;
a first functional surface wiring formed in an exposed layer of the wiring layers above the substrate, the first functional surface wiring connecting to the electronic element, the first functional surface wiring being arranged in the part of the substrate;
a second functional surface wiring formed in the exposed layer of the wiring layers above the substrate, the second functional surface wiring being disposed in a plurality of first peripheral portions adjacent to a plurality of second peripheral portions of the substrate, one of the first peripheral portions being surrounded by a region arranging the encapsulation member and two of the second peripheral portions, the second peripheral portions being corner areas of the substrate; and
an intermediate wiring formed in an intermediate layer of the wiring layers;
wherein the substrate has a first through-hole disposed in the part of the substrate, the first through-hole being connected to the first functional surface wiring and the intermediate wiring; and
wherein the substrate has a second through-hole disposed in the first peripheral portions of the substrate, the second through-hole being connected to the intermediate wiring and the second functional surface wiring, the intermediate wiring extending from the first through-hole to the second through-hole.
2. The electronic device according to claim 1 , wherein the electronic device further includes plating leads for electroplating the exposed layer of the wiring layers above the substrate or conductive members placed in the first through-hole or the second through-hole, the plating leads being arranged in the second peripheral portions of the substrate, the plating leads being connected to third through-holes formed in the second peripheral portions of the substrate, the third through-holes connected to the intermediate wiring.
3. The electronic device according to claim 2 , wherein the electronic device further includes an external terminal for electrically connecting the electronic element to another surface of the substrate, the external terminal being connected to the first functional surface wiring, the second functional surface wiring, the first through-hole or the second through-hole.
4. The electronic device according to claim 3 , wherein the external terminal is a solder ball.