IP Library Granted Patent US 7,893,790
Granted Patent B2
US 7,893,790 · App. 12/135,094 · Granted Feb 22, 2011

Electronic device and method of matching the impedance thereof

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Quick Facts
Patent No.
US 7,893,790
App. No.
12/135,094
Granted
Feb 22, 2011
Kind
B2
Abstract

An electronic device includes a first and a second micro-electromechanical switch assembly on a substrate, between which first and second switch assembly a first line having a first impedance and a second line having a second impedance are present. The first switch assembly includes an input terminal and a first and a second output terminal connected to the first and the second line, respectively. The second switch assembly includes an output terminal and a first and second input terminal connected to the first and second line, respectively.

Claims (27)

1. An electronic device comprising:

an impedance matching network including

a first and a second micro-electromechanical switch assembly on a substrate;

a first line connected between the first switch assembly and the second switch assembly, the first line having a first impedance;

a second line connected between the first switch assembly and the second switch assembly, the second line having a second impedance, the first switch assembly having an input terminal and a first and a second output terminal connected to the first and the second line respectively, and the second switch assembly having an output terminal and a first and second input terminal connected to the first and second line respectively; and

a tunable micro-electromechanical capacitor connected to at least one of the first line and the second line,

wherein the first switch assembly is configured to, in one switching condition thereof, connect the input terminal of the first switch assembly to the first input terminal of the second switch assembly via the first output terminal and the first line, and to, in another switching condition thereof, connect the input terminal of the first switch assembly to the second input terminal of the second switch assembly via the second output terminal and the second line.

2. An electronic device as claimed in claim 1 , wherein the first line comprises an inductor turn and wherein the tunable micro-electromechanical capacitor includes a cantilever as one capacitive plate, a conductive layer as a second capacitive plate and a dielectric layer between the cantilever and the conductive layer.

3. An electronic device as claimed in claim 2 , wherein the second line is an interconnect, and a further inductor turn is connected to the output terminal of the second switch assembly, therewith providing a step-wise tunable inductor.

4. An electronic device as claimed in claim 2 , wherein the second line comprises an inductor turn of different length than the inductor turn of the first line, therewith providing a step-wise tunable inductor.

5. An electronic device as claimed in claim 1 , wherein the first and second line each comprise a thin-film capacitor.

6. An electronic device as claimed in claim 1 , wherein in the first switch assembly the input terminal is connected to a fixed electrode and the first and second output terminals are provided as a first and second movable electrode respectively, each of the movable electrodes being movable between a first position in which it is separated from the fixed electrode through an airgap, and a second position in which it is at least substantially in physical contact with the fixed electrode, the first switch assembly including a first and a second control structure configured to move the first and second movable electrodes towards or away from the fixed electrode through application of a control voltage.

7. An electronic device as claimed in claim 6 , wherein the first and second control structure have a first and a second electrodes, which second electrodes of the first and second control structure are mechanically connected with but electrically isolated from the first and second movable electrode respectively, such that a displacement of a second electrode moves the corresponding movable electrode towards or away from the fixed electrode, which second electrode is displaceable by application of a voltage difference between the first and second electrode of the control structure.

8. An electronic device as claimed in claim 7 , further comprising at least partially electrically insulating cantilever arms that connect the second electrodes of the control structures and the movable electrodes, the cantilever arms having the movable electrodes at a first end and having a common support structure at a second opposite end.

9. An electronic device as claimed in claim 8 , wherein the second electrodes of the control structures are electrically connected to one ground plane, the ground plane being at least partially present in the support structure.

10. An electronic device as claimed in claim 1 , wherein the input terminal of the first switch assembly is connected to a signal line through a vertical interconnect, the signal line being present in a metal layer.

11. An electronic device as claimed in claim 3 , further comprising another micro-electromechanical capacitor.

12. A mobile telecommunication apparatus comprising the electronic device according to claim 1 .

13. An electronic device comprising:

a first and a second micro-electromechanical switch assembly on a substrate, the first switch assembly having an input terminal and first and second output terminals, the second switch assembly having an output terminal and first and second input terminals;

a first line connected between the first output terminal of the first switch assembly and the first input terminal of the second switch assembly, the first line being an inductor turn having a first length;

a second line connected between the second output of the first switch assembly and the second input of the second switch assembly, the second line being an inductor turn having a second length that is different from the first length, and

a tunable micro-electromechanical capacitor connected to at least one of the first line and the second line

wherein the first switch assembly is configured to, in a first switching condition, connect the input terminal of the first switch assembly to the first input terminal of the second switch assembly via the first output terminal and the first line, and to, in a second switching condition, connect the input terminal of the first switch assembly to the second input terminal of the second switch assembly via the second output terminal and the second line.

14. The electronic device of claim 13 , wherein the second switch assembly is configured to, in the first switching condition, connect the first input terminal of the second switch assembly to the output terminal of the second switch assembly, and to, in the second switching condition, connect the second input terminal of the second switch assembly to the output terminal of the second switch assembly.

15. The electronic device of claim 13 , wherein the first switch assembly is further configured to, in a third switching condition, connect the input terminal of the first switch assembly to the first input terminal of the second switch assembly via the first output terminal and the first line, and to connect the input terminal of the first switch assembly to the second input terminal of the second switch assembly via the second output terminal and the second line.

16. The electronic device of claim 14 , wherein the second switch assembly is configured to, in the third switching condition, connect both the first and second input terminal of the second switch assembly to the output terminal of the second switch assembly.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CHANGE OF NAME Recorded Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043955/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2015
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 035021/0353 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2015
From: VAN DELDEN, MARTINUS HERMANUS WILHELMUS MARIA
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 035021/0335 →