Semiconductor devices with a field shaping region
View Patent ↗A semiconductor device includes a semiconductor region having a pn junction and a field shaping region located adjacent the pn junction to increase the reverse breakdown voltage of the device. The field shaping region is coupled via capacitive voltage coupling regions to substantially the same voltages as are applied to the pn junction. When a reverse voltage is applied across the pn junction and the device is non-conducting, a capacitive electric field is present in a part of the field shaping region which extends beyond a limit of the pn junction depletion region which would exist in the absence of the field shaping region. The electric field in the field shaping region inducing a stretched electric field limited to a correspondingly stretched pn junction depletion region in the semiconductor region.
1. A semiconductor device including a semiconductor region having p and n semiconductor regions which form a pn junction and a field shaping region located adjacent only one of the p and n semiconductor regions to increase the reverse breakdown voltage of the device, wherein the field shaping region is insulating material and the field shaping region extends from a first capacitive voltage coupling region to a second capacitive voltage coupling region which are provided to apply, in use, substantially the same voltages as are applied to the pn junction, the material and capacitive coupling of the field shaping region being such that, when a reverse voltage is applied across the pn junction and the device is non-conducting, a capacitive electric field is present in a part of the field shaping region which extends beyond a limit of the pn junction depletion region which would exist in the absence of the field shaping region, the electric field in the field shaping region inducing a stretched electric field limited to a correspondingly stretched pn junction depletion region in the semiconductor region.
2. A device as claimed in claim 1 , wherein the field shaping region insulating material has a dielectric constant greater than that of silicon dioxide.
3. A device as claimed in claim 2 , wherein the field shaping region insulating material has a dielectric constant greater than that of silicon nitride.
4. A device as claimed in claim 3 , wherein the field shaping insulating material is tantalum oxide Ta 2 O 5 .
5. A device as claimed in claim 1 , wherein the insulating field shaping region is adjacent the n semiconductor region.
6. A device as claimed in claim 1 , wherein said insulating field shaping region is adjacent only one side of the n semiconductor region.
7. A device as claimed in claim 1 , wherein said insulating field shaping region is adjacent both sides of the n semiconductor region.
8. A device as claimed in claim 1 , wherein at least one of the first and second capacitive voltage coupling regions comprises a conductive material region.
9. A device as claimed in claim 8 , wherein the conductive material region is integral with a main electrode of the device.
10. A device as claimed in claim 1 , wherein the capacitively coupled insulating field shaping region is separated by an insulating region from the semiconductor region having the pn junction.
11. A device as claimed in claim 1 , wherein the device is a diode device and the pn junction is the rectifying junction of the diode device.
12. A device as claimed in claim 1 , wherein the device is a bipolar transistor and the pn junction is the junction between the base region and a collector drift region of the device.
13. A device as claimed in claim 1 , wherein the device is a field effect transistor and the pn junction is the junction between the channel accommodating body region and a drain drift region of the device.
14. A device as claimed in claim 12 , wherein the drift region is non-uniformly doped.
15. A device as claimed in claim 12 , wherein the stretched pn junction depletion region extends only partly through said drift region.
16. A semiconductor device, comprising:
a p-based semiconductor region and an adjacent n-based semiconductor region, with a pn junction formed therebetween;
a field shaping region located adjacent one of the semiconductor regions, and not the other of the semiconductor regions, configured and arranged to
increase the reverse breakdown voltage of the device,
include an insulation material,
extend from a first capacitive voltage coupling region to a second capacitive voltage coupling region which are provided to apply, in use, substantially the same voltages as are applied to the pn junction, the insulation material and capacitive coupling of the field shaping region being such that, when a reverse voltage is applied across the pn junction and the device is non-conducting, a capacitive electric field is present in a part of the field shaping region that extends beyond a limit of the pn junction depletion region which would exist in the absence of the field shaping region, the electric field in the field shaping region inducing a stretched electric field limited to a correspondingly stretched pn junction depletion region in the semiconductor region.