Method and apparatus for fast and local anneal of anti-ferromagnetic (AF) exchange-biased magnetic stacks

1. A method of thermally treating a magnetic layer of a wafer, comprising:

annealing, for a predetermined short duration, a magnetic layer of a single wafer; and

applying a plurality of local magnetic fields to said magnetic layer obtained without making electrical contact to the wafer, said local magnetic fields being applied in different directions to different areas of the single wafer.

2. The method of claim 1 , wherein said annealing comprises:

heating an entirety of said single wafer.

3. The method of claim 1 , wherein said annealing comprises:

heating a local area on the single wafer.

4. The method of claim 1 , wherein said annealing comprises:

heating said magnetic layer within a range of about 300 to about 500 degrees C.

5. The method of claim 1 , wherein said annealing comprises:

heating said magnetic layer for a duration within a range of about 1 second to about 60 seconds in the presence of a magnetic field.

6. The method of claim 1 , wherein said annealing comprises:

annealing by one of a flash lamp, a laser, a flashlight, a focused heat lamp, and a rapid thermal anneal (RTA) lamp.

7. The method of claim 1 , wherein said applying said plurality of local magnetic fields to said magnetic layer is conducted after said annealing.

8. The method of claim 7 , wherein said applying is performed to align a pinning of the magnetic layer.

9. The method of claim 3 , wherein said annealing comprises annealing a desired spot on the single wafer, said method further comprising:

performing one of a spot-to-spot processing and a line-to-line processing.

10. The method of claim 1 , wherein said applying said plurality of local magnetic fields to said magnetic layer comprises applying a magnetic field to specific portions of said magnetic layer.

11. A method for processing a magnetic stack, comprising:

annealing a single wafer having a magnetic stack formed thereon, with a predetermined fast anneal in a presence of a magnetic field; and

applying a plurality of local magnetic fields to said magnetic layer, said local magnetic field being generated without electrical wires on the wafer, said local magnetic fields being applied in different directions to different areas of the single wafer.

12. The method of claim 11 , further comprising:

cooling the single wafer by at least one of cooling liquid, helium, nitrogen, argon, and a vacuum.

13. The method of claim 11 , further comprising:

annealing only portions of the single wafer at a time.

14. The method of claim 11 , further comprising:

changing a direction of an applied magnetic field point-by-point.

15. A method for processing a magnetic stack, comprising:

annealing a single wafer having a magnetic stack formed thereon, with a predetermined fast anneal in a presence of a magnetic field; and

annealing multiple separate locations at the same time

wherein said magnetic field is applied in different directions to different areas of the single wafer.

16. The method of claim 11 , further comprising:

rotating the single wafer and annealing another area of the single wafer in a different direction.

17. The method of claim 11 , further comprising:

rotating the field and annealing another area of the single wafer in a different direction.

18. The method of claim 11 , further comprising:

cooling only portions of the single wafer.

19. The method of claim 1 , further comprising:

cooling the single wafer by at least one of cooling liquid, helium, nitrogen, argon, and a vacuum.

20. The method of claim 1 , further comprising:

annealing only portions of the single wafer at a time.

21. The method of claim 1 , further comprising:

changing a direction of the local magnetic field point-by-point.

22. The method of claim 1 , further comprising:

annealing multiple separate locations at the same time.

23. The method of claim 1 , further comprising:

rotating the single wafer and annealing another area of the single wafer in a different direction.

24. The method of claim 1 , further comprising:

rotating the field and annealing another area of the single wafer in a different direction.

25. The method of claim 1 , further comprising:

cooling only portions of the single wafer.

26. The method of claim 1 , wherein said applying said plurality of local magnetic fields to said magnetic layer comprises applying a magnetic field to less than an entirety of said magnetic layer.