Semiconductor device, method for manufacturing semiconductor device, and method for designing manufacturing semiconductor device
View Patent ↗A semiconductor device includes a semiconductor chip, a moisture resistant ring provided in the semiconductor chip and having a chamfered flat part in a position corresponding to a corner of the semiconductor chip, and a first monitor pattern formed inside the moisture resistant ring. At least a part of the first monitor pattern is disposed inside an n-sided polygonal area (n is a natural number which is 4 or higher than 4) situated within the moisture resistant ring, and outside a quadrangular area situated inside the n-sided polygonal area. The n-sided polygonal area has a vertex at least at each of a first end and a second end of the chamfered flat part, and the quadrangular area has a vertex at least at a middle point of the chamfered flat part.
1. A semiconductor device comprising:
a semiconductor chip;
a moisture resistant ring provided in the semiconductor chip and having a chamfered flat part in a position corresponding to a corner of the semiconductor chip; and
a first monitor pattern formed inside the moisture resistant ring,
wherein at least a part of the first monitor pattern is disposed inside an n-sided polygonal area (n is a natural number which is 4 or higher than 4) situated within the moisture resistant ring, and outside a quadrangular area situated inside the n-sided polygonal area,
the n-sided polygonal area has a vertex at least at each of a first end and a second end of the chamfered flat part, and
the quadrangular area has a vertex at least at a middle point of the chamfered flat part.
2. The semiconductor device according to claim 1 , further comprising a second monitor pattern, a third monitor pattern, and a fourth monitor pattern which have an arrangement same to an arrangement of the first monitor pattern,
wherein the first monitor pattern, the second monitor pattern, the third monitor pattern, and the fourth monitor pattern are disposed in four corners of the semiconductor chip, respectively.
3. The semiconductor device according to claim 1 ,
wherein the first monitor pattern is disposed outside an I/O ring of the semiconductor chip.
4. A semiconductor device comprising:
a semiconductor element formed in a first area of a semiconductor chip;
a frame surrounding the semiconductor element; and
a first monitor pattern formed in an n-sided polygonal (n is a natural number which is 4 or higher than 4) second area disposed in a corner of the semiconductor chip and inside the frame,
wherein the frame has a chamfered flat part at each of four corners of the frame, and one side of the n-sided polygonal second area is parallel to the chamfered flat part.
5. The semiconductor device according to claim 4 , further comprising a second monitor pattern, a third monitor pattern, and a fourth monitor pattern which have relative positions same to a relative position of the first monitor pattern,
wherein the first monitor pattern, the second monitor pattern, the third monitor pattern, and the fourth monitor pattern are disposed in four corners of the semiconductor chip, respectively.
6. The semiconductor device according to claim 5 ,
wherein the frame is a seal ring.