Bonded wafer structure and method of fabrication

1. A method of packaging electronics, the method comprising:

providing a first wafer;

providing a second wafer;

depositing a polymer material over a surface of the first wafer; selectively removing a portion of the polymer from the first wafer to create a void in the polymer;

placing the first wafer over the second wafer and in contact with the polymer; applying a pressure at a temperature to bond the first wafer to the second wafer; and

curing the polymer to bond the first wafer to the second wafer, wherein the first wafer comprises a first electronic component and a second electronic component and the first electronic component is substantially sealed by the polymer.

2. A method as claimed in claim 1 , wherein the second electronic component is disposed in the void.

3. A method as claimed in claim 2 , wherein the selectively removing further comprises exposing a portion of the surface of the first wafer.

4. A method as claimed in claim 3 , wherein the selectively removing further comprises exposing a portion of the surface of the first wafer and the second electronic component is disposed in the void.

5. A method as claimed in claim 1 , wherein the first wafer and the second wafer each comprise gallium arsenide.

6. A method as claimed in claim 1 , wherein the first wafer comprises a glass material.

7. A method as claimed in claim 1 , wherein the first wafer comprises a liquid crystal polymer.

8. A method as claimed in claim 1 , wherein the polymer comprises one of:

a patternable polymer; an etchable polymer; or a polymer film.

9. A method as claimed in claim 1 , further comprising, after the curing dicing the bonded wafers to form at least one die.

10. A bonded wafer structure, comprising:

a first wafer comprising an inner surface and an outer surface;

a second wafer comprising an inner surface and an outer surface;

a cured polymer disposed between the first wafer and the second wafer;

a void in the cured polymer extending from the inner surface of the first wafer to the inner surface of the second wafer;

a first electronic component disposed over either the inner surface of the first wafer or the inner surface of the second wafer and in the void; and

a second electronic component disposed over the same surface as the first electronic component and substantially sealed by the cured polymer.

11. A bonded wafer structure as claimed in claim 10 , wherein the first wafer and the second wafer each comprise gallium arsenide.

12. A bonded wafer structure as claimed in claim 10 , wherein the first and second electronic components are both disposed over the first wafer and the second wafer comprises a glass material.

13. A bonded wafer structure as claimed in claim 12 , wherein the first wafer comprises gallium arsenide.

14. A bonded wafer structure as claimed in claim 12 , further comprising a third electronic component disposed over either the inner surface or the outer surface of the second wafer.

15. A method of packaging electronics,

the method comprising:

providing a first wafer;

providing a second wafer;

depositing a polymer material over a surface of the first wafer; selectively removing a portion of the polymer from the first wafer to create a void in the polymer;

placing the first wafer over the second wafer and in contact with the polymer;

applying a pressure at a temperature to bond the first wafer to the second wafer; and

curing the polymer to bond the first wafer to the second wafer, wherein the second wafer comprises a first electronic component disposed over the surface and a second electronic component disposed over the surface, and the first electronic component is substantially encapsulated in the polymer when the first wafer is placed over the second wafer.