Data generation method for semiconductor device, and electron beam exposure system
A method includes: generating electron beam exposure data, used for electron beam exposure, from design data of a semiconductor device; extracting differential information indicating a difference in shape between an electron beam exposure pattern formed on a substrate through electron beam exposure on the basis of the electron beam exposure data and a photoexposure pattern formed on the substrate through photoexposure on the basis of the design data of the semiconductor device; determining whether the size of the difference in shape between the electron beam exposure pattern and the photoexposure pattern falls within a predetermined reference value; acquiring shape changed exposure data by changing the shape of the pattern of the electron beam exposure data in accordance with the differential information and updating the electron beam exposure data; and repeating the differential extraction, the determination and the updating when the size of the difference falls outside the predetermined reference value.
1. A method for performing electron beam exposure by an electron beam exposure apparatus comprising:
correcting a dose of electron beam exposure using design data of a semiconductor device;
generating electron beam exposure data, used for electron beam exposure, and photoexposure data, used for photoexposure, from the design data of a semiconductor device;
extracting differential information that indicates a differential portion between a shape of an electron beam exposure pattern formed on a substrate through electron beam exposure on a basis of the electron beam exposure data and a shape of a photoexposure pattern formed on the substrate through photoexposure on a basis of the photoexposure data of the semiconductor device;
determining whether a size of the differential portion between the shape of the electron beam exposure pattern and the shape of the photoexposure pattern falls within a reference value;
acquiring shape changed exposure data in accordance with the difference information between the shape of the photoexposure pattern and an exchanged shape of an electron beam exposure pattern that is changed in accordance with the photoexposure pattern while the dose of electron beam exposure is fixed, and updating by overwriting the electron beam exposure data with the shape changed exposure data if the size of the differential portion does not fall within the reference value;
repeating the extracting differential information, the determining and the acquiring shape changed exposure data when the size of the differential portion falls outside the predetermined reference value; and
performing electron beam exposure, using the updated electron beam exposure data, by the electron beam exposure apparatus.
2. The method for performing electron beam exposure by an electron by an electron beam exposure apparatus according to claim 1 , wherein the updating step further includes: classifying the size of the difference between the shapes into multiple stages; and determining a shape variation by which the pattern of the electron beam exposure data, corresponding to the difference, is changed in shape in each of the stages.
3. The method for performing electron beam exposure by an electron exposure apparatus according to claim 2 , wherein the shape variation is specified as a value that is smaller than a target shape variation necessary to eliminate the difference through execution of the updating step once.
4. The method for performing electron beam exposure by an electron beam exposure apparatus according to claim 1 , wherein the generating photoexposure data for photoexposure, includes:
generating photoexposure data, used for simulating photoexposure, from the design data; and
generating, from the photoexposure data, a shape that simulates the photoexposure pattern.
5. The method for performing electron beam exposure by an electron beam exposure apparatus according to claim 1 , wherein the generating electron beam exposure data, includes:
generating electron beam exposure data, used for simulating electron beam exposure, from the design data; and
generating, from the electron beam exposure data, a shape that simulates the electron beam exposure pattern.
6. The method for performing electron beam exposure by an electron beam exposure apparatus according to claim 1 , wherein in the extracting differential information extraction of the differential information is suppressed when the size of the differential portion is smaller than a predetermined allowable value.
7. The method for performing electron beam exposure by an electron beam exposure apparatus according to claim 1 :
wherein the generating photoexposure data for photoexposure, includes:
generating photoexposure data, used for creating a mask for simulation of photoexposure or a mask for photoexposure, from the design data, and
executing a correction process that includes at least one of a dummy pattern generation for planarization, an optical proximity correction, a local flare correction, or a microloading effect correction for etching, and
wherein the generating electron beam exposure data includes executing a correction process that includes at least one of a dummy pattern generation for planarization, a proximity correction, a stitching correction, or a microloading effect correction for etching.
8. An electron beam exposure system comprising:
a data generation device that includes: a correcting unit that corrects a dose of electron beam exposure using design data of a semiconductor device; an electron beam exposure data generation unit that generates electron beam exposure data, used for electron beam exposure, from the design data of a semiconductor device and a photoexposure data generation unit that generates photoexposure data, used for photoexposure, from the design data of a semiconductor device;
a photoexposure pattern storage unit that stores the shape of a photoexposure pattern formed on a substrate through photoexposure on a basis of the photoexposure data;
an electron beam exposure pattern storage unit that stores the shape of an electron beam exposure pattern formed on the substrate through electron beam exposure on the basis of the electron beam exposure data;
a differential extraction unit that extracts differential information that indicates a difference between the shape of the photoexposure pattern and the shape of the electron beam exposure pattern;
a determination unit that determines whether the size of the difference between the shape of the electron beam exposure pattern and a shape of the photoexposure pattern falls within a predetermined reference value;
an updating unit that acquires shape changed exposure data n accordance with the difference information between the shape of the photoexposure pattern and an exchanged shape of an electron beam exposure pattern that is changed in accordance with the photoexposure pattern while the dose of electron beam exposure is fixed, and updating by overwriting the electron beam exposure data with the shape changed exposure data if the size of the differential portion does not fall within the reference value; and
a control unit that repeatedly starts the differential extraction unit, the determination unit, and the updating unit when the size of the difference is outside the predetermined reference value; and
an exposure apparatus that creates a pattern on a semiconductor substrate in accordance with the electron beam exposure data generated by the data generation device.