Programmable metallization memory cell with planarized silver electrode
Programmable metallization memory cells having a planarized silver electrode and methods of forming the same are disclosed. The programmable metallization memory cells include a first metal contact and a second metal contact, an ion conductor solid electrolyte material is between the first metal contact and the second metal contact, and either a silver alloy doping electrode separates the ion conductor solid electrolyte material from the first metal contact or the second metal contact, or a silver doping electrode separates the ion conductor solid electrolyte material from the first metal contact. The silver electrode includes a silver layer and a metal seed layer separating the silver layer from the first metal contact.
1. A programmable metallization memory cell comprising:
a first metal contact and a second metal contact;
an ion conductor solid electrolyte material between the first metal contact and the second metal contact and in contact with the second metal contact; and
a silver alloy doping electrode in contact with the first metal contact and in contact with the ion conductor solid electrolyte material and the silver alloy doping electrode separating the ion conductor solid electrolyte material from the first metal contact, the silver alloy doping electrode comprising an atomic mixture of silver atoms and aluminum atoms, gold atoms, ruthenium atoms, or titanium atoms and the silver alloy doping electrode has a surface RMS roughness of less than 2.0 nm and the silver alloy doping electrode being disposed closer to the semiconductor substrate than the ion conductor solid electrolyte material.
2. A programmable metallization memory cell according to claim 1 wherein the silver alloy comprises silver atoms and aluminum atoms.
3. A programmable metallization memory cell according to claim 1 wherein the silver alloy comprises silver atoms and titanium atoms.
4. A programmable metallization memory cell according to claim 1 wherein the silver alloy comprises from 50 to 85 atomic % silver atoms and from 50 to 15 atomic % of aluminum atoms, gold atoms, ruthenium atoms, or titanium atoms.
5. A programmable metallization memory cell comprising:
a first metal contact and a second metal contact;
an ion conductor solid electrolyte material between the first metal contact and the second metal contact and in contact with the second metal contact; and
a silver doping electrode in contact with the ion conductor solid electrolyte material and the silver doping electrode separating the ion conductor solid electrolyte material from the first metal contact, the silver doping electrode comprising a silver layer and a metal seed layer separating the silver layer from the first metal contact and the silver doping electrode has a surface RMS roughness of less than 2.0 nm and the silver doping electrode being disposed closer to the semiconductor substrate than the ion conductor solid electrolyte material.
6. A programmable metallization memory cell according to claim 5 wherein the metal seed layer comprises titanium, aluminum, or ruthenium.
7. A programmable metallization memory cell according to claim 5 wherein the metal seed layer comprises titanium.
8. A programmable metallization memory cell according to claim 5 wherein the metal seed layer has a thickness in a range from 0.5 to 5 nm.