Semiconductor device and programming method
View Patent ↗The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
1. A method for fabricating a semiconductor device comprising:
mounting a semiconductor chip on a chip mounting portion;
coupling a wire between the semiconductor chip and the chip mounting portion
disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip, wherein the wire is provided in contact with the sheet-shaped resin portion.
2. The method as claimed in claim 1 , wherein disposing the sheet-shaped resin includes disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip.
3. The method as claimed in claim 2 , wherein forming the resin sealing portion includes:
disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and
sealing the semiconductor chip by the uncured resin.
4. The method as claimed in claim 1 , wherein forming the resin sealing portion is forming the resin sealing portion by transfer molding.
5. The method as claimed in claim 1 , wherein the sheet-shaped resin does not include a filler.
6. The method as claimed in claim 1 , wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.
7. The method as claimed in claim 1 , wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.
8. The method as claimed in claim 1 , wherein the semiconductor chip has stacked semiconductor chips.
9. The method as claimed in claim 1 wherein the wire is partially embedded in the sheet-shaped resin portion.
10. A wireless communications device, comprising:
a memory comprising:
a semiconductor chip;
a chip mounting portion mounting the semiconductor chip;
a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;
a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion;
a processor;
a communications component;
a transmitter;
a receiver; and
an antenna connected to the transmitter circuit and the receiver circuit.
11. The wireless communications device of claim 10 , wherein said memory is NAND flash memory.
12. The wireless communications device of claim 10 , wherein said memory is NOR flash memory.
13. The wireless communications device of claim 10 , wherein said memory comprises at least one memory cell operable to store more than one bit.
14. The wireless communications device of claim 10 , wherein the wire is partially embedded in the sheet-shaped resin portion.
15. A computing device comprising:
a processor;
an input component;
an output component;
a memory comprising:
a semiconductor chip;
a chip mounting portion mounting the semiconductor chip;
a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;
a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
16. The computing device of claim 15 , wherein said computing device is a personal computer (PC).
17. The computing device of claim 15 , wherein said computing device is a personal digital assistant (PDA).
18. The computing device of claim 15 , wherein said computing device is a gaming system.
19. The computing device of claim 15 , wherein the wire is partially embedded in the sheet-shaped resin portion.
20. A portable media player comprising:
a processor;
a cache;
a user input component;
a coder-decoder component; and
a memory comprising:
a semiconductor chip;
a chip mounting portion mounting the semiconductor chip;
a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;
a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
21. The portable media player of claim 20 , wherein said portable media player is a portable music player.
22. The portable media player of claim 20 , wherein said portable media player is a portable video player.
23. The portable media player of claim 20 , wherein said memory comprises:
a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
24. The portable media player of claim 20 , wherein the wire is partially embedded in the sheet-shaped resin portion.