Semiconductor device and control method of the same
The present invention provides a semiconductor memory and a control method therefore, the semiconductor device including a first current-voltage conversion circuit ( 16 ) connected to a core cell ( 12 ) provided in a nonvolatile memory cell array ( 10 ), a second current-voltage conversion circuit ( 26 ) connected to a reference cell ( 22 ) through a reference cell data line ( 24 ), a sense amplifier ( 18 ) sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit ( 28 ) comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit ( 30 ) charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened.
1. A memory device comprising:
a core cell region comprising a plurality of core cells;
a reference cell region comprising a plurality of reference cells;
a first current-voltage conversion circuit coupled to the core cell region;
a second current-voltage conversion circuit coupled to the reference cell region wherein the second current-conversion circuit comprises an average circuit operable to average outputs from the plurality of reference cells;
a charging circuit operable to charge a reference cell data line when a voltage of the reference cell data line is below a predefined voltage; and
a sense amplifier coupled to the first current-voltage conversion circuit and the second current-voltage conversion circuit.
2. The memory device of claim 1 , wherein the second current-voltage conversion circuit outputs an output of the average circuit.
3. The memory device of claim 1 , wherein the average circuit comprises a differential circuit, wherein the differential circuit amplifies the difference between data of a core cell and data of a reference cell.
4. The memory device of claim 1 , wherein:
the second current-voltage conversion circuit comprises a differential circuit to which the voltage level at the reference cell data line and the predefined voltage level are input; the compare circuit comprises a first FET having a gate connected to an output from the differential circuit and a source and drain connected to a voltage source and an output node and a second FET having a gate connected to a gate of a current source FET in the differential circuit and a source and a drain connected to the output node and a ground level; and
an output of the circuit for comparing is connected to the output node.
5. The memory device of claim 1 , wherein the average circuit comprises a first average circuit outputting to the first current-voltage conversion circuit, and a second average circuit outputting an output thereof to the sense amplifier.
6. A semiconductor device comprising:
a first current-voltage conversion means coupled to a core cell;
a second current-voltage conversion means coupled to a reference cell through a reference cell data line;
averaging means operable to average outputs from multiple reference cells, wherein the second current-voltage conversion means outputs an output from the averaging means:
a sensing means operable to sense an output from the first current-voltage conversion means and an output from the second current-voltage conversion means;
means for comparing a voltage level at the reference cell data line with a predefined voltage level; and
means for charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging of the reference cell data line.
7. The semiconductor device of claim 6 , wherein the sensing means starts sensing after pre-charging of the reference cell data line is finished.
8. The semiconductor device of claim 6 , wherein the second current-voltage conversion means comprises an averaging means operable to average outputs from multiple reference cells; and the second current-voltage conversion means outputs an output from the averaging means.
9. The semiconductor device of claim 8 , wherein the averaging means has a first average means outputting to the first current-voltage conversion means, and a second average means outputting an output thereof to the sensing means.
10. The semiconductor device of claim 6 , wherein:
the second current-voltage conversion means comprises a differential means to which the voltage level at the reference cell data line and the predefined voltage level are input; the means for comparing comprises a first FET having a gate connected to an output from the differential means and a source and drain connected to a voltage source and an output node and a second FET having a gate connected to a gate of a current source FET in the differential means and a source and a drain connected to the output node and a ground level; and
an output of the means for comparing is connected to the output node.
11. A semiconductor device comprising:
a first circuit coupled to a memory cell;
a second circuit coupled to a reference cell, wherein the second circuit is operable to average outputs from a plurality of reference cells;
a third circuit operable to sense an output of the first circuit and an output of the second circuit; and
a fourth circuit operable to charge a reference cell data line when a voltage of the reference cell data line is below a predefined voltage.
12. The semiconductor of claim 11 , further comprising:
a fifth circuit operable to compare a voltage level at the reference cell data line with a predefined voltage level.
13. The semiconductor of claim 12 , further
a sixth circuit, wherein the sixth circuit amplifies the difference between data of a core cell and data of a reference cell.
14. The semiconductor of claim 13 , wherein:
the second circuit has a differential circuit to which the voltage level at the reference cell data line and the predefined voltage level are input;
the fifth circuit has a first FET having a gate connected to an output from the sixth circuit and a source and drain connected to a voltage source and an output node and a second FET having a gate connected to a gate of a current source FET in the sixth circuit and a source and a drain connected to the output node and a ground level; and
an output of the sixth circuit is connected to the output node.
15. The semiconductor of claim 11 , wherein the second circuit has an average circuit averaging outputs from multiple reference cells, and the second circuit outputs an output from the average circuit.
16. The semiconductor of claim 15 , wherein the average circuit comprises a first average circuit outputting to the first circuit, and a second average circuit outputting an output thereof to the third circuit.
17. The semiconductor of claim 11 , wherein the core cell is a portion of a flash memory.
18. The semiconductor of claim 17 , wherein the flash memory is NAND flash memory.
19. The semiconductor of claim 17 , wherein the flash memory is NOR flash memory.