Magnetic layer

1. A process, comprising:

coupling a magnetic layer of an iron platinum alloy and a substrate; and

changing the temperature of the alloy as the alloy is deposited on the substrate to vary the degree of chemical ordering of the alloy with respect to distance from the substrate within the layer, wherein the degree of chemical ordering of the alloy decreases within the magnetic layer with respect to distance from the substrate.

2. The process of claim 1 , wherein changing the temperature further comprises changing the temperature of the alloy by over 500-degrees Celsius as the alloy is deposited on the substrate.

3. The process of claim 1 , wherein changing the temperature further comprises continuously changing the temperature of the alloy as the alloy is deposited on the substrate.

4. The process of claim 1 , wherein the alloy in a first portion of the magnetic layer consists essentially of a fully-ordered form of the alloy.

5. The process of claim 1 , wherein the alloy in a first portion of the magnetic layer has a granular microstructure with an average grain size of less than about ten nanometers.

6. The process of claim 5 , further comprising using carbon as a boundary material for the alloy in the first portion of the magnetic layer.

7. The process of claim 6 , wherein the alloy further comprises at least one of copper, chromium, zirconium, boron, tantalum, silicon dioxide, magnesium oxide, aluminum oxide, and boron trioxide.

8. The process of claim 1 , further comprising:

depositing a seed layer between the substrate and the magnetic layer; and

depositing an overcoat overlaying the magnetic layer, wherein the compositions of the seed layer and the overcoat do not include iron and platinum.

9. A process, comprising:

changing the temperature of an iron platinum alloy as the alloy is deposited on a substrate to vary the degree of chemical ordering of the alloy with respect to distance from the substrate by discretely varying the degree such that the alloy, in a first sub-layer closer to the substrate, has a greater degree of chemical ordering than does the alloy in a second sub-layer that is further from the substrate.

10. The process of claim 9 , wherein changing the temperature further comprises changing the temperature of the alloy by annealing.

11. The process of claim 9 , wherein the alloy in the first sub-layer is fully ordered, and wherein the alloy in the second sub-layer is disordered.

12. The process of claim 9 , wherein the alloy in the first sub-layer consists essentially of molecules having a face-centered tetragonal molecular structure, and wherein the alloy in the second sub-layer consists essentially of molecules having a face-centered cubic molecular structure.

13. The process of claim 12 , wherein the first sub-layer has a substantially uniform thickness, and wherein the second sub-layer has a substantially uniform thickness.

14. The process of claim 13 , wherein the thickness of the first sub-layer is between about one to ten nanometers, and wherein the thickness of the second sub-layer is between about one to ten nanometers.

15. The process of claim 13 , wherein the combined thickness of the first and second sub-layers is between about five to thirty nanometers.

16. A process, comprising:

decreasing the temperature of an iron platinum alloy as the alloy is deposited on a substrate to vary the degree of chemical ordering of the alloy with respect to distance from the substrate, wherein decreasing the temperature comprises decreasing the temperature of the alloy by over 500-degrees Celsius.

17. The process of claim 16 , wherein the alloy is deposited at a first temperature of about 700-degrees Celsius and subsequently deposited at a second temperature of about 200-degrees or less.

18. The process of claim 17 , wherein the second temperature is room temperature.