IP Library Granted Patent US 8,098,510
Granted Patent B2
US 8,098,510 · App. 12/944,790 · Granted Jan 17, 2012

Variable resistive memory punchthrough access method

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Quick Facts
Patent No.
US 8,098,510
App. No.
12/944,790
Granted
Jan 17, 2012
Kind
B2
Abstract

Variable resistive punchthrough access methods are described. The methods include switching a variable resistive data cell from a high resistance state to a low resistance state by passing a write current through the magnetic tunnel junction data cell in a first direction. The write current is provided by a transistor being electrically coupled to the variable resistive data cell and a source line. The write current passes through the transistor in punchthrough mode.

Claims (25)

1. A method comprising:

applying a voltage across a source region and a drain region of a metal-oxide-semiconductor field effect transistor that is sufficient to merge a source depletion region and a drain depletion region of the metal-oxide-semiconductor field effect transistor and conduct a write current through the metal-oxide-semiconductor field effect transistor;

switching a variable resistive data cell from a high resistance state to a low resistance state by passing the write current through the variable resistive data cell in a first direction, the write current provided by the metal-oxide-semiconductor field effect transistor being electrically coupled to the variable resistive data cell.

2. A method according to claim 1 , further comprising switching the variable resistive data cell from the low resistance state to the high resistance state by passing the write current through the variable resistive data cell in a second direction opposing the first direction, the write current provided by the metal-oxide-semiconductor field effect transistor.

3. A method according to claim 1 , wherein the metal-oxide-semiconductor field effect transistor is a NMOS transistor or a PMOS transistor.

4. A method according to claim 1 , wherein the variable resistive data cell is a magnetic tunnel junction data cell.

5. A method according to claim 1 , wherein the write current in the first direction has about the same magnitude as the write current in the second direction.

6. A method according to claim 3 , wherein the magnetic tunnel junction data cell is a spin-transfer torque data cell.

7. A method according to claim 1 , further comprising passing a read current through the variable resistive data cell by activating a gate of the metal-oxide-semiconductor field effect transistor.

8. A method according to claim 1 , further comprising passing a read current through the variable resistive data cell, the read current formed by applying a voltage across a source region and a drain region of a metal-oxide-semiconductor field effect transistor that is sufficient to merge a source depletion region and a drain depletion region of the metal-oxide-semiconductor field effect transistor and conduct the read current through the metal-oxide-semiconductor field effect transistor.

9. A method according to claim 1 , wherein the write current in the first direction and the write current in the second direction is formed by a voltage difference across a source region and drain region of the transistor having a magnitude equal to or greater than a punchthrough voltage for the transistor.

10. A method comprising:

switching a variable resistive data cell from a high resistance state to a low resistance state by passing a write current through the variable resistive data cell in a first direction, the write current provided by a metal-oxide-semiconductor field effect transistor being electrically coupled to the variable resistive data cell, the write current passing through the metal-oxide-semiconductor field effect transistor in punchthrough mode.

11. A method according to claim 10 , further comprising switching the variable resistive data cell from the low resistance state to the high resistance state by passing the write current through the variable resistive data cell in a second direction opposing the first direction, the write current provided by the metal-oxide-semiconductor field effect transistor operating in punchthrough mode.

12. A method according to claim 10 , wherein the metal-oxide-semiconductor field effect transistor is a NMOS transistor or a PMOS transistor.

13. A method according to claim 10 , wherein the variable resistive data cell is a magnetic tunnel junction data cell.

14. A method according to claim 10 , wherein the write current in the first direction has about the same magnitude as the write current in the second direction.

15. A method according to claim 13 , wherein the magnetic tunnel junction data cell is a spin-transfer torque data cell.

16. A method according to claim 10 , further comprising passing a read current through the variable resistive data cell by activating a gate of the metal-oxide-semiconductor field effect transistor.

17. A method comprising:

applying a voltage across a source region and a drain region of a first metal-oxide-semiconductor field effect transistor that is sufficient to merge a source depletion region and a drain depletion region of the first metal-oxide-semiconductor field effect transistor and conduct a write current through the first metal-oxide-semiconductor field effect transistor;

activating a common metal-oxide-semiconductor field effect transistor to allow the write current to pass through the common metal-oxide-semiconductor field effect transistor, the common metal-oxide-semiconductor field effect transistor electrically coupled to a source line and the first variable resistive data cell, the common metal-oxide-semiconductor field effect transistor electrically coupled to a second variable resistive data cell.

18. A method according to claim 17 wherein the first and second variable resistive data cells are spin-transfer torque data cells.

19. A method according to claim 17 wherein the write current selectively passes through the first and second variable resistive data cells.

20. A method according to claim 17 wherein the common metal-oxide-semiconductor field effect transistor is electrically connected to three or more variable resistive data cells.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 23, 2025
From: THE BANK OF NOVA SCOTIA
To: SEAGATE TECHNOLOGY PUBLIC LIMITED COMPANY; SEAGATE TECHNOLOGY; SEAGATE TECHNOLOGY HDD HOLDINGS; I365 INC.; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL; SEAGATE HDD CAYMAN; SEAGATE TECHNOLOGY (US) HOLDINGS, INC.
Reel/Frame 072193/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2025
From: THE BANK OF NOVA SCOTIA
To: SEAGATE TECHNOLOGY US HOLDINGS, INC.; EVAULT, INC. (F/K/A I365 INC.); SEAGATE TECHNOLOGY LLC
Reel/Frame 070363/0903 →
RELEASE OF SECURITY INTEREST Recorded Jul 23, 2024
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: SEAGATE TECHNOLOGY LLC; EVAULT INC
Reel/Frame 068457/0076 →
RELEASE OF SECURITY INTEREST Recorded May 20, 2024
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: SEAGATE TECHNOLOGY LLC; EVAULT, INC. (F/K/A I365 INC.); SEAGATE TECHNOLOGY US HOLDINGS, INC.
Reel/Frame 067471/0955 →
SECURITY AGREEMENT Recorded Oct 15, 2012
From: SEAGATE TECHNOLOGY LLC; EVAULT, INC. (F/K/A I365 INC.); SEAGATE TECHNOLOGY US HOLDINGS, INC.
To: THE BANK OF NOVA SCOTIA, AS ADMINISTRATIVE AGENT
Reel/Frame 029127/0527 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Oct 15, 2012
From: SEAGATE TECHNOLOGY LLC; EVAULT, INC. (F/K/A I365 INC.); SEAGATE TECHNOLOGY US HOLDINGS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 029253/0585 →
SECURITY AGREEMENT Recorded Mar 24, 2011
From: SEAGATE TECHNOLOGY LLC
To: THE BANK OF NOVA SCOTIA, AS ADMINISTRATIVE AGENT
Reel/Frame 026010/0350 →