Semiconductor device and test method
A semiconductor device includes a semiconductor substrate including an element region, an inner sealing and an outer sealing which are formed on the element region and have a first opening part and a second opening part, respectively, a multilayer interconnection structure which is formed on the substrate and stacks multiple inter-layer insulation films each including a wiring layer, a moisture resistant film formed between a first inter-layer insulation film and a second inter-layer insulation film which are included in the multilayer interconnection structure, a first portion which extended from a first side of the moisture resistant film and passes the first opening part, a second portion which extended from a second side of the moisture resistant film and passes through the second opening part, and a wiring pattern including a via plug which penetrates the moisture resistant film and connects the first portion and the second portion.
1. A semiconductor device comprising:
a semiconductor substrate on which at least a first element region and a second element region are formed;
a first outer sealing and a first inner sealing configured to be formed on the first element region;
a second outer sealing and a second inner sealing configured to be formed on the second element region, wherein the first outer sealing and the second outer sealing are separated by an intermediate region, and face each other, in which an electrode test pad is formed to be electrically contacted to the mutual connection wiring pattern in the intermediate region;
a first core region configured to be surrounded by the first inner sealing in the first element region;
a second core region configured to be surrounded by the second inner sealing in the second element region; and
a multilayer interconnection structure configured to be formed by a laminate which stacks multiple inter-layer insulation films extending from the first element region to the second element region on the semiconductor substrate, each of the multiple inter-layer insulation films including a wiring layer;
wherein the multilayer interconnection structure includes a first multilayer interconnection structure portion on the first element region and a second multilayer interconnection structure portion on the second element region;
the first multilayer interconnection structure portion includes the first outer sealing and the first inner sealing which are formed outside the first core region;
the second multilayer interconnection structure portion includes the second outer sealing and the second inner sealing which are formed outside the second core region;
the wiring layer forms the first outer sealing and the first inner sealing in the first multilayer interconnection structure portion;
the wiring layer forms the second outer sealing and the second inner sealing in the second multilayer interconnection structure portion;
the multilayer interconnection structure includes a moisture resistant film extending from the first element region to the second element region; and
a mutual connection wiring pattern extends by sequentially crossing the first inner sealing, the first outer sealing, the second outer sealing, and the second inner sealing from the first core region,
wherein the mutual connection wiring pattern includes:
a first portion in which either one of a bottom side and a top side of the moisture resistant film extends from the first core region to a first sealing region between the first inner sealing and the first outer sealing;
a second portion in which either one of the bottom side and the top side of the moisture resistant film extends from the first sealing region to a second sealing region between the second outer sealing and the second inner sealing; and
a third portion in which the first side of the moisture resistant film extends from the second sealing region to the second core region,
wherein the first portion and the second portion of the mutual connection wiring pattern are connected by a first via plug penetrating the moisture resistant film in the first sealing region, and
the second portion and the third portion of the mutual connection wiring pattern are connected by a second via plug penetrating the moisture resistant film in the second sealing region.
2. The semiconductor device as claimed in claim 1 , wherein in the first sealing region in the first element region, an electrode test pad is formed to be electrically contacted to the mutual connection pattern.
3. A test method for testing a semiconductor device which comprises:
a semiconductor substrate on which at least a first element region to form a first internal circuit and a second element region to form a second internal circuit are formed;
a first outer sealing and a first inner sealing configured to be formed on the first element region;
a second outer sealing and a second inner sealing configured to be formed on the second element region;
a first core region configured to be surrounded by the first inner sealing in the first element region;
a second core region configured to be surrounded by the second inner sealing in the second element region; and
a multilayer interconnection structure configured to be formed by a laminate which stacks multiple inter-layer insulation films extending from the first element region to the second element region on the semiconductor substrate, each of the multiple inter-layer insulation films including a wiring layer;
wherein the multilayer interconnection structure includes a first multilayer interconnection structure portion on the first element region and a second multilayer interconnection structure portion on the second element region;
the first multilayer interconnection structure portion includes the first outer sealing and the first inner sealing which are formed outside the first core region;
the second multilayer interconnection structure portion includes the second outer sealing and the second inner sealing which are formed outside the second core region;
the wiring layer forms the first outer sealing and the first inner sealing in the first multilayer interconnection structure portion;
the wiring layer forms the second outer sealing and the second inner sealing in the second multilayer interconnection structure portion;
the multilayer interconnection structure includes a moisture resistant film extending from the first element region to the second element region; and
a mutual connection wiring pattern extends by sequentially crossing the first inner sealing, the first outer sealing, the second outer sealing, and the second inner sealing from the first core region,
wherein the mutual connection wiring pattern includes:
a first portion in which either one of a bottom side and a top side of the moisture resistant film extends from the first core region to a first sealing region between the first inner sealing and the first outer sealing;
a second portion in which either one of the bottom side and the top side of the moisture resistant film extends from the first sealing region to a second sealing region between the second outer sealing and the second inner sealing; and
a third portion in which the first side of the moisture resistant film extends from the second sealing region to the second core region,
wherein the first portion and the second portion of the mutual connection wiring pattern are connected by a first via plug penetrating the moisture resistant film in the first sealing region, and
the second portion and the third portion of the mutual connection wiring pattern are connected by a second via plug penetrating the moisture resistant film in the second sealing region,
wherein the test method is performed in a state in which at least the first internal circuit and the second internal circuit are tested in a state in which the first internal circuit and the second internal circuit are formed on the semiconductor substrate, by contacting a probe to the electrode test pad.
4. The test method as claimed in claim 3 , wherein the first internal circuit and the second internal circuit are subsequently tested in a state of contacting the probe to the electrode test pad.
5. The test method as claimed in claim 3 , wherein after the first internal circuit and the second internal circuit are tested, the semiconductor substrate is cut to separate the first element region as a first semiconductor chip from the second element region as a second semiconductor chip.