Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof

1. A heat dissipation material comprising:

a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part;

a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects;

a coating film configured to cover a side surface of each of the plurality of linearly-structured objects;

a filler layer configured to be permeated between the plurality of linearly-structured objects each covered by the coating film.

2. The heat dissipation material as claimed in claim 1 , wherein the first terminal parts of the plurality of linearly-structured objects are connected with each other by the first diamond-like carbon layers.

3. The heat dissipation material as claimed in claim 1 , further comprising:

a second diamond-like carbon layer configured to cover the second terminal part of each of the plurality of linearly-structured objects.

4. The heat dissipation material as claimed in claim 3 , wherein the second terminal parts of the plurality of linearly-structured objects are connected with each other by the second diamond-like carbon layers.

5. The heat dissipation material as claimed in any claim 1 , wherein the filler layer is formed with a thermoplastic resin.