IP Library Granted Patent US 9,197,158
Granted Patent B2
US 9,197,158 · App. 14/394,116 · Granted Nov 24, 2015

Dynamic frequency divider circuit

Inventors: Akbar Ghazinour (Ottobrunn, DE); Saverio Trotta (Munich, DE)
Assignee: FREESCALE SEMICONDUCTOR, INC.
H03B19/14H03F3/45085H03F3/60H03K23/667H03L7/00H03F2200/423H03F2203/45702
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Quick Facts
Patent No.
US 9,197,158
App. No.
14/394,116
Granted
Nov 24, 2015
Kind
B2
Abstract

The invention relates to a Frequency Divider Circuit for dividing an input RF signal to a frequency divided RF signal. The circuit comprises a RF pair, a switching-quad pair coupled in series with a transimpedance amplifier and a double pair of emitter followers. The circuit comprises coupling elements for providing first DC paths to first amplifier paths of the RF pair and for providing second DC paths to second amplifier paths of the series arrangement of the switching-quad pair and the transimpedance amplifier. The first DC paths are independent of the second DC paths. RF connections are provided to couple the first and the second amplifier paths for transferring a signal from the first amplifier paths to the second amplifier paths.

Claims (50)

1. A dynamic frequency divider circuit for operating in a mm-wave band and for dividing an input RF signal to a frequency divided RF signal, the dynamic frequency divider circuit comprising:

an RF pair comprising a differential pair of first amplifier elements and first differential control terminals for receiving the input RF signal, the differential pair comprising first amplifier paths being response to the input RF signal;

a switching-quad pair comprising a double differential pair of second amplifier elements in a cross-coupled arrangement and second differential control terminals for receiving a feedback signal, wherein the double differential pair comprises double second amplifier paths responsive to the feedback signal, and the switching-quad pair comprises differential output terminals connected with the double second amplifier paths;

a transimpedance amplifier coupled in series with the switching-quad pair and configured to amplify the signal of the differential output terminals;

a double pair of emitter followers configured to buffer the amplified signal received from the transimpedance amplifier, wherein the double pair of emitter followers comprises follower input terminals configured to receive the amplified signal from the transimpedance amplifier and further comprising output terminals for providing the feedback signal and the frequency divided RF signal;

DC voltage supply rails;

first coupling elements configured to provide the first amplifier paths with a first DC connection between the DC voltage supply rails;

second coupling elements configured to provide the double second amplifier paths with a second DC connection between the DC voltage supply rails, wherein the second DC connection being parallel to the first DC connection; and

RF connections between the first amplifier paths and double second amplifier paths configured to transfer a RF signal from the first amplifier paths to the double second amplifier paths.

2. The dynamic frequency divider circuit according to claim 1 , wherein the first coupling elements comprise RF chokes being coupled between the RF pair and a first one of the DC voltage supply rails.

3. The dynamic frequency divider circuit according to claim 2 , wherein the first coupling elements comprise transmission lines being coupled between the RF pair and the first one of the DC voltage supply rails.

4. The dynamic frequency divider circuit according to claim 3 , wherein

the RF chokes comprise a first terminal and a second terminal,

the transmission lines comprise a first terminal and a second terminal,

the RF chokes are connected with the first terminal to the first one of the DC voltage supply rails, and

the transmission lines are connected with the first terminal to the second terminal of the RF chokes and with the second terminal to the RF pair.

5. The dynamic frequency divider circuit according to claim 2 , wherein the RF chokes are transmission lines of a length substantially equal to a quarter wavelength of a fundamental frequency of the input RF signal.

6. The dynamic frequency divider circuit according to claim 1 , wherein the second coupling elements comprise RF chokes being coupled between the switching-quad pair and a second one of the DC voltage supply rails.

7. The dynamic frequency divider circuit according to claim 6 , wherein the second coupling elements comprise transmission lines being coupled between the switching-quad pair and the second one of the DC voltage supply rails.

8. The dynamic frequency divider circuit according to claim 7 , wherein

the RF chokes comprise a first terminal and a second terminal,

the transmission lines comprise a first terminal and a second terminal,

the RF chokes are connected with the first terminal to the second one of the DC voltage supply rails, and

the transmission lines are connected with the first terminal to the second terminal of the RF chokes and with the second terminal to the switching quad pair.

9. The dynamic frequency divider circuit according to claim 8 , wherein the RF chokes are transmission lines of a length substantially equal to a quarter wavelength of a fundamental frequency of the input RF signal.

10. The dynamic frequency divider circuit according to claim 1 , wherein the RF connections comprise DC isolation elements for isolating a DC voltage of the first amplifier paths from a DC voltage of the double second amplifier paths.

11. The dynamic frequency divider circuit according to claim 10 , wherein the DC isolating elements comprise a capacitor.

12. The dynamic frequency divider circuit according to claim 11 , wherein the capacitor is a mim capacitor.

13. The dynamic frequency divider circuit according to claim 1 , wherein the RF connections comprise transmission lines being coupled between the first amplifier paths and the double second amplifier paths.

14. The dynamic frequency divider circuit according to claim 13 , wherein each RF connection comprises two transmission lines coupled in series.

15. The dynamic frequency divider circuit according to claim 14 , wherein the DC isolation element of a single RF connection is arranged in between and coupled to the two transmission lines.

16. The dynamic frequency divider circuit according to claim 15 , wherein the transmission lines are configured to match an output impedance of an amplifier formed by the RF pair to an input impedance of a closed looped mixer comprising the switching-quad pair, transimpedance amplifier and the double pair of emitter followers.

17. A semiconductor device comprising a dynamic frequency divider circuit for operating in a mm-wave band and for dividing an input RF signal to a frequency divided RF signal, the dynamic frequency divider circuit comprising:

an RF pair comprising a differential pair of first amplifier elements and comprising first differential control terminals for receiving the input RF signal, the differential pair comprising first amplifier paths being response to the input RF signal;

a switching-quad pair comprising a double differential pair of second amplifier elements in a cross-coupled arrangement and comprising second differential control terminals for receiving a feedback signal, the double differential pair comprising double second amplifier paths being responsive to the feedback signal, the switching-quad pair comprising differential output terminals connected with the double second amplifier paths;

a transimpedance amplifier being coupled in series with the switching-quad pair and being configured to amplify the signal of the differential output terminals;

a double pair of emitter followers for buffering the amplified signal received from the transimpedance amplifier, the double pair of emitter followers comprising follower input terminals for receiving the amplified signal from the transimpedance amplifier and comprising output terminals for providing the feedback signal and the frequency divided RF signal;

DC voltage supply rails;

first coupling element for providing the first amplifier paths with a first DC connection between the DC voltage supply rails;

second coupling elements for providing the double second amplifier paths with a second DC connection between the DC voltage supply rails, the second DC connection being parallel to the first DC connection; and

RF connections between the first amplifier paths and double second amplifier paths for transferring a RF signal from the first amplifier paths to the double second amplifier paths.

18. A radar system comprising a dynamic frequency divider circuit for operating in a mm-wave band and for dividing an input RF signal to a frequency divided RF signal, the dynamic frequency divider circuit comprising:

an RF pair comprising a differential pair of first amplifier elements and comprising first differential control terminals for receiving the input RF signal, the differential pair comprising first amplifier paths being response to the input RF signal;

a switching-quad pair comprising a double differential pair of second amplifier elements in a cross-coupled arrangement and comprising second differential control terminals for receiving a feedback signal, the double differential pair comprising double second amplifier paths being responsive to the feedback signal, the switching-quad pair comprising differential output terminals connected with the double second amplifier paths;

a transimpedance amplifier being coupled in series with the switching-quad pair and being configured to amplify the signal of the differential output terminals;

a double pair of emitter followers for buffering the amplified signal received from the transimpedance amplifier, the double pair of emitter followers comprising follower input terminals for receiving the amplified signal from the transimpedance amplifier and comprising output terminals for providing the feedback signal and the frequency divided RF signal;

DC voltage supply rails;

first coupling element for providing the first amplifier paths with a first DC connection between the DC voltage supply rails;

second coupling elements for providing the double second amplifier paths with a second DC connection between the DC voltage supply rails, the second DC connection being parallel to the first DC connection; and

RF connections between the first amplifier paths and double second amplifier paths for transferring a RF signal from the first amplifier paths to the double second amplifier paths.

Assignments (24)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0535 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0444 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037358/0001 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0001 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0923 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035034/0019 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2014
From: GHAZINOUR, AKBAR; TROTTA, SAVERIO
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 033935/0473 →
Continuity (1)
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