Tape release systems and methods for semiconductor dies
View Patent ↗Systems and methods for releasing semiconductor dies from an adhesive tape or film. In some embodiments, a semiconductor manufacturing device may include: a chuck plate configured to support an array of semiconductor dies, where each die in the array has a top surface and a bottom surface, where each die's bottom surface is bonded to an adhesive tape, and where the chuck plate comprises one or more channels configured to apply a negative pressure to the adhesive tape; and a tape release element having an irregular surface, the tape release element disposed between the chuck plate and the adhesive tape.
1. A semiconductor manufacturing device, comprising:
a chuck plate configured to support an array of semiconductor dies, wherein each die in the array has a top surface and a bottom surface, wherein each die's bottom surface is bonded to an adhesive tape, and wherein the chuck plate comprises one or more channels configured to apply a negative pressure to the adhesive tape;
a tape release element having an irregular surface, the tape release element disposed between the chuck plate and the adhesive tape; and
a lid configured to cover the array of semiconductor dies and to apply a positive pressure to the adhesive tape.
2. The semiconductor manufacturing device of claim 1 , wherein the array of semiconductor dies comprises a semiconductor wafer.
3. The semiconductor manufacturing device of claim 1 , wherein the tape release element comprises a wire mesh.
4. The semiconductor manufacturing device of claim 1 , wherein the tape release element comprises a plurality of protrusions fabricated on a surface of the chuck plate.
5. The semiconductor manufacturing device of claim 1 , wherein the chuck plate comprises a heating element configured to apply heat to the adhesive tape.
6. The semiconductor manufacturing device of claim 1 , wherein the irregular surface comprises a plurality of peaks and valleys.
7. The semiconductor manufacturing device of claim 6 , wherein the adhesive tape is configured to, upon application of the negative pressure, conform to at least a portion of the peaks and valleys to reduce a contact surface between the adhesive tape and the array of semiconductor dies.
8. The semiconductor manufacturing device of claim 1 , further comprising a vacuum pickup tool configured to pick up each individual one of the plurality of dies upon application of the negative pressure.
9. The semiconductor manufacturing device of claim 1 , wherein the vacuum pickup tool is configured to pick up each individual one of the plurality of dies without the use of an ejector pin.
10. A method, comprising:
disposing a plurality of semiconductor chips over an uneven surface of a chuck plate, wherein the plurality of semiconductor chips are bonded to an adhesive tape;
conforming at least a portion of the adhesive tape to the uneven surface by applying a pressure to the plurality of semiconductor chips; and
removing at least one of the plurality of semiconductor chips from the adhesive tape, wherein the pressure comprises a positive pressure applied to a top side of the plurality of semiconductor chip via one or more vacuum lines of a lid prior to removing the at least one semiconductor chip.
11. The method of claim 10 , wherein the uneven surface comprises a wire mesh.
12. The method of claim 10 , wherein the uneven surface comprises a plurality of protrusions fabricated on a surface of the chuck plate.
13. The method of claim 10 , further comprising applying heat to the plurality of semiconductor chips prior to removing the at least one semiconductor chip.
14. The method of claim 10 , wherein the pressure comprises a negative pressure applied to an underside of the plurality of semiconductor chip via one or more vacuum lines of the chuck plate prior to removing the at least one semiconductor chip.
15. A tape release system, comprising:
a chuck plate configured to support an array of semiconductor dies bonded to an adhesive tape;
a static tape release element disposed between the chuck plate and the adhesive tape; and
a lid configured to cover the array of semiconductor dies and to apply a pressure to the adhesive tape.
16. The tape release system of claim 15 , wherein the chuck plate comprises one or more vacuum lines configured to apply a negative pressure to a bottom side of the adhesive tape.
17. The tape release system of claim 15 , wherein the tape release element comprises a wire mesh having a plurality of peaks and valleys.
18. The tape release system of claim 15 , wherein the tape release element comprises a plurality of protrusions fabricated on a surface of the chuck plate.