SEMICONDUCTOR SENSOR DEVICE FORMED WITH GEL SHEET
A method for assembling a pressure sensor device uses a pressure-sensitive gel material that is applied to an active region of a pressure-sensing integrated circuit (IC) die. A molding compound is dispensed over the pressure-sensitive gel material to encapsulate the gel material. A portion of the molding compound is then removed to expose the gel material to an ambient environment outside of the packaged semiconductor device.
1 . A method for assembling a packaged semiconductor device, the method comprising:
(a) applying a pressure-sensitive gel material to an active region of a pressure-sensing integrated circuit (IC) die;
(b) dispensing a molding compound onto all exposed surfaces of the pressure-sensitive gel material to encapsulate the pressure-sensitive gel material; and
(c) removing a portion of the molding compound to expose the pressure-sensitive gel material to an ambient environment outside of the packaged semiconductor device.
2 . The method of claim 1 , wherein:
the pressure-sensitive gel material is a film; and
step (a) comprises adhering the film to an active region of the pressure-sensing IC die such that the film extends from the pressure-sensing IC die to a side perimeter of the packaged semiconductor device.
3 . The method of claim 2 , wherein step (c) comprises performing singulation along the side perimeter of the packaged semiconductor device to separate the pressure-sensing IC die from another pressure-sensing IC die, wherein the singulation removes the portion of the molding compound on the side perimeter of the packaged semiconductor device.
4 . The method of claim 3 , wherein step (c) comprises performing grinding to remove the portion of the molding compound on an upper perimeter of the packaged semiconductor device.
5 . The method of claim 2 , wherein:
in step (c), removing the portion of the molding compound exposes an opening in the molding compound at a perimeter of the packaged semiconductor device; and
the pressure-sensitive gel material occupies the opening at the perimeter of the packaged semiconductor device.
6 . The packaged semiconductor device assembled using the method of claim 1 .
7 . A packaged semiconductor device, comprising:
a pressure-sensing integrated circuit (IC) die;
a pressure-sensitive gel material disposed on an active region of the pressure-sensing IC die; and
molding compound encapsulating the pressure-sensitive gel material, wherein:
a first surface of the pressure-sensitive gel material is exposed to an ambient environment outside of the packaged semiconductor device;
a second surface of the pressure-sensitive gel material contacts the pressure-sensing IC die; and
every other surface of the pressure-sensitive gel material is in contact with the molding compound.
8 . The packaged semiconductor device of claim 7 , wherein:
the pressure-sensitive gel material is a film;
the film is adhered to the active region of the pressure-sensing IC die and extends from the pressure-sensing IC die to a side perimeter of the packaged semiconductor device; and
the first surface of the pressure-sensitive gel material is exposed to the ambient environment via an opening in the molding compound on the side perimeter of the packaged semiconductor device.
9 . The packaged semiconductor device of claim 7 , wherein:
the pressure-sensitive gel material extends from the pressure-sensing IC die to an upper perimeter of the packaged semiconductor device; and
an opening in the molding compound on the upper perimeter of the packaged semiconductor device exposes the first surface of the pressure-sensitive gel material to the ambient environment.
10 . The packaged semiconductor device of claim 9 , wherein the pressure-sensitive gel material has a substantially spherical segment shape.
11 . The packaged semiconductor device of claim 7 , wherein the packaged semiconductor device does not include a lid.
12 . A packaged semiconductor device, comprising:
a pressure-sensing integrated circuit (IC) die;
a pressure-sensitive gel film mounted on an active region of the pressure-sensing IC die and extending from the pressure-sensing IC die to a side perimeter of the packaged semiconductor device; and
molding compound encapsulating the pressure-sensitive gel film, wherein an opening in the molding compound on the side perimeter of the packaged semiconductor device exposes the pressure-sensitive gel film to an ambient environment outside of the packaged semiconductor device.