IP Library Granted Patent US 9,671,288
Granted Patent B2
US 9,671,288 · App. 14/936,716 · Granted Jun 6, 2017

Solid-state photodetector with a spectral response of the generated photocurrent is controlled by an applied bias voltage

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Quick Facts
Patent No.
US 9,671,288
App. No.
14/936,716
Granted
Jun 6, 2017
Kind
B2
Abstract

A solid-state photodetector with variable spectral response that can produce a narrow or wide response spectrum of incident light. Some embodiments include a solid-state device structure that includes a first photodiode and a second photodiode that share a common anode region. Bias voltages applied to the first photodiode and/or the second photodiode may be used to control the thicknesses of depletion regions of the photodiodes and/or a common anode region to vary the spectral response of the photodetector. Thickness of the depletion regions and/or the common anode region may be controlled based on resistance between multiple contacts of the common anode region and/or capacitance of the depletion regions. Embodiments include control circuits and methods for determining spectral characteristics of incident light using the variable spectral response photodetector.

Claims (13)

1. A photodetector, comprising:

a first photodiode that absorbs a first portion of incident light in a first depletion region, the first photodiode generating a photocurrent responsive to the absorbed first portion of incident light; and

a second photodiode that absorbs a second portion of the incident light in a second depletion region, the absorbed second portion comprises a portion of the incident light not including the first portion of the incident light,

wherein a spectral response of the photocurrent is controlled based at least in part on a first bias voltage applied between a first cathode contact coupled with a first cathode region of the first photodiode and a common anode contact coupled with a common anode region of the first photodiode and the second photodiode.

2. The photodetector of claim 1 , wherein a thickness of the first depletion region is controlled at least in part by the first bias voltage and a second bias voltage applied between the common anode contact and a second cathode contact coupled with a second cathode region of the second photodiode.

3. The photodetector of claim 1 , wherein the common anode contact comprises:

a first common anode contact coupled with the common anode region; and

a second common anode contact coupled with the common anode region,

wherein a resistance between the first common anode contact and the second common anode contact depends at least in part on a thickness of the common anode region.

4. The photodetector of claim 1 , further comprising:

a semiconductor substrate layer comprising the first depletion region; and

a transparent gate electrode in between a light reception portion of the photodetector that receives the incident light and the first depletion region,

wherein the transparent gate electrode is biased to form the first cathode region of the first photodiode between the first depletion region and the transparent gate electrode.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2025
From: POLARIS POWERLED TECHNOLOGIES, LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 070203/0047 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
CHANGE OF NAME Recorded Jan 18, 2018
From: LED DISPLAY TECHNOLOGIES, LLC
To: POLARIS POWERLED TECHNOLOGIES, LLC
Reel/Frame 045084/0315 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 19, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION
Reel/Frame 043902/0544 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2017
From: MICROSEMI CORPORATION
To: LED DISPLAY TECHNOLOGIES, LLC
Reel/Frame 043137/0738 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →