IP Library Granted Patent US 10,367,472
Granted Patent B2
US 10,367,472 · App. 15/056,102 · Granted Jul 30, 2019

Acoustic resonator having integrated lateral feature and temperature compensation feature

Inventors: Dariusz Burak (Fort Collins, CO); John Choy (Westminster, CO); Phil Nikkel (Loveland, CO); Kevin J. Grannen (Thornton, CO)
Assignee: Avago Technologies International Sales Pte. Limited
H03H9/175H01L41/0471H03H9/02102H03H9/02118H03H9/131H03H9/173
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Quick Facts
Patent No.
US 10,367,472
App. No.
15/056,102
Granted
Jul 30, 2019
Kind
B2
Abstract

A bulk acoustic wave (BAW) resonator device includes a bottom electrode on a substrate over one of a cavity and an acoustic mirror, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer. At least one of the bottom electrode and the top electrode includes an integrated lateral feature configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch.

Claims (48)

1. A bulk acoustic wave (BAW) resonator device, comprising:

a bottom electrode on a substrate over one of a cavity and an acoustic mirror;

a piezoelectric layer on the bottom electrode;

a top electrode on the piezoelectric layer; and

a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer,

wherein at least one of the bottom electrode and the top electrode comprises an integrated lateral feature configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch.

2. The BAW resonator device of claim 1 , wherein the integrated lateral feature is arranged between planar top and bottom surfaces of the at least one of the bottom electrode and the top electrode.

3. The BAW resonator device of claim 2 , wherein the integrated lateral feature comprises an integrated low velocity frame located at an outer region of the at least one of the bottom electrode and the top electrode, the integrated low velocity frame substantially surrounding an inner portion located at a center region of the at least one of the bottom electrode and the top electrode,

wherein the integrated low velocity frame and the inner portion are formed at the same level, such that the integrated low velocity frame and the inner portion have substantially the same thickness.

4. The BAW resonator device of claim 3 , wherein the integrated low velocity frame is formed of a first material and the inner portion is formed of a second material, the first material having a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode, relative to a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode of the second material, that lowers an effective sound velocity of a portion of the at least one of the bottom electrode and the top electrode formed of the first material.

5. The BAW resonator device of claim 2 , wherein the integrated lateral feature comprises an integrated high velocity frame located at an outer region of the at least one of the bottom electrode and the top electrode, the integrated high velocity frame substantially surrounding an inner portion located at a center region of the at least one of the bottom electrode and the top electrode,

wherein the integrated high velocity frame and the inner portion are formed at the same level, such that the integrated high velocity frame and the inner portion have substantially the same thickness.

6. The BAW resonator device of claim 5 , wherein the inner portion is formed of a first material and the integrated high velocity frame is formed of a second material, the first material having a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode, relative to a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode of the second material, that lowers an effective sound velocity of a portion of the at least one of the bottom electrode and the top electrode formed of the first material.

7. The BAW resonator device of claim 2 , wherein the integrated lateral feature comprises one of an integrated low velocity frame and an integrated high velocity frame located at an outer region of the at least one of the bottom electrode and the top electrode, the integrated low velocity frame having a thickness less than a thickness of a composite electrode.

8. The BAW resonator device of claim 1 , wherein a temperature compensation feature comprises a temperature compensating layer in the at least one the bottom electrode and the top electrode comprising the integrated lateral feature.

9. The BAW resonator device of claim 1 , wherein the bottom electrode comprises the integrated lateral feature and the top electrode comprises the temperature compensation feature.

10. The BAW resonator device of claim 1 , wherein the top electrode comprises the integrated lateral feature and the bottom electrode comprises the temperature compensation feature.

11. A bulk acoustic wave (BAW) resonator device, comprising:

a bottom electrode on a substrate over one of a cavity and an acoustic mirror;

a piezoelectric layer on the bottom electrode; and

a top electrode on the piezoelectric layer,

wherein at least one of the bottom electrode and the top electrode is a hybrid electrode comprising a temperature compensating layer having a positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer, and an integrated frame configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch.

12. The BAW resonator device of claim 11 , wherein the integrated frame comprises an integrated low velocity frame formed by a first material located at an outer region of the hybrid electrode and an inner portion formed by a second material located at a center region of the hybrid electrode, the first material having a lower sound velocity than the second material.

13. The BAW resonator device of claim 11 , wherein the integrated frame comprises an integrated high velocity frame formed by a second material located at an outer region of the hybrid electrode and an inner portion formed by a first material located at a center region of the hybrid electrode, the first material having a lower sound velocity than the second material.

14. The BAW resonator device of claim 11 , wherein the bottom electrode comprises the hybrid electrode and the top electrode comprises a frame electrode having an integrated frame.

15. The BAW resonator device of claim 11 , wherein the top electrode comprises the hybrid electrode and the bottom electrode comprises a frame electrode having an integrated frame.

16. The BAW resonator device of claim 11 , wherein the hybrid electrode comprises an outside electrode layer, an inside electrode layer and an interposer layer, the temperature compensating layer being formed between the inside electrode layer and the interposer layer and the interposer layer being formed between the temperature compensating layer and the piezoelectric layer.

17. A thin film bulk acoustic resonator (FBAR), comprising:

a bottom electrode on a substrate over one of a cavity and an acoustic mirror;

a piezoelectric layer on the bottom electrode;

a top electrode on the piezoelectric layer;

a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer; and

an integrated lateral feature formed within at least one of the bottom electrode and the top electrode, and configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch.

18. The FBAR of claim 17 , wherein the temperature compensation feature comprises a temperature compensation layer in one of the bottom electrode, the piezoelectric layer, or the top electrode.

19. The FBAR of claim 18 , wherein the integrated lateral feature is formed within the at least one of the bottom electrode and the top electrode not including the temperature compensation layer.

20. A bulk acoustic wave (BAW) resonator device, comprising:

a bottom electrode on a substrate over one of a cavity and an acoustic mirror;

a piezoelectric layer on the bottom electrode;

a top electrode on the piezoelectric layer; and

a temperature compensation feature comprising a temperature compensating layer buried in the piezoelectric layer, the temperature compensating feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer, wherein at least one of the bottom electrode and the top electrode comprises an integrated lateral feature configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch.

21. The BAW resonator device of claim 20 , wherein the integrated lateral feature is arranged between planar top and bottom surfaces of the at least one of the bottom electrode and the top electrode.

22. The BAW resonator device of claim 21 , wherein the integrated lateral feature comprises an integrated low velocity frame located at an outer region of the at least one of the bottom electrode and the top electrode, the integrated low velocity frame substantially surrounding an inner portion located at a center region of the at least one of the bottom electrode and the top electrode,

wherein the integrated low velocity frame and the inner portion are formed at the same level, such that the integrated low velocity frame and the inner portion have substantially the same thickness.

23. The BAW resonator device of claim 22 , wherein the integrated low velocity frame is formed of a first material and the inner portion is formed of a second material, the first material having a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode, relative to a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode of the second material, that lowers an effective sound velocity of a portion of the at least one of the bottom electrode and the top electrode formed of the first material.

24. The BAW resonator device of claim 21 , wherein the integrated lateral feature comprises an integrated high velocity frame located at an outer region of the at least one of the bottom electrode and the top electrode, the integrated high velocity frame substantially surrounding an inner portion located at a center region of the at least one of the bottom electrode and the top electrode,

wherein the integrated high velocity frame and the inner portion are formed at the same level, such that the integrated high velocity frame and the inner portion have substantially the same thickness.

25. The BAW resonator device of claim 24 , wherein the inner portion is formed of a first material and the integrated high velocity frame is formed of a second material, the first material having a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode, relative to a sound velocity, acoustic impedance and a location in the at least one of the bottom electrode and the top electrode of the second material, that lowers an effective sound velocity of a portion of the at least one of the bottom electrode and the top electrode formed of the first material.

26. The BAW resonator device of claim 20 , wherein the integrated lateral feature comprises one of an integrated low velocity frame and an integrated high velocity frame located at an outer region of the at least one of the bottom electrode and the top electrode, the integrated low velocity frame having a thickness less than a thickness of a composite electrode.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2016
From: BURAK, DARIUSZ; CHOY, JOHN; NIKKEL, PHIL; GRANNEN, KEVIN J.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 039120/0140 →
Continuity (3)
Continuation 13766993 · Feb 14, 2013
Continuation In Part 13660941 · Oct 25, 2012
Related Publication 20160182011A1 · Jun 23, 2016
Cited By (7)
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