SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A PACKAGED ELECTRONIC DEVICE
A packaged electronic device includes a package substrate, an electronic component die mounted to the package substrate, and an encapsulant bonded to a portion of the package substrate at a catechol group adhesion promoted interface that includes benzene rings bonded with the package substrate and the encapsulant.
1 . A method comprising:
attaching an electronic component to a package substrate;
encapsulating a surface of the package substrate with an encapsulant, wherein prior to the encapsulating, an adhesion promoter is applied to the surface, wherein the adhesion promoter includes catechol group molecules.
2 . The method of claim 1 , wherein the catechol group molecules include molecules of at least one of a group consisting of dihydroxybenzene, dopamine, alpha-methyldopamine, norepinephrine, dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and 5-hydroxydopamine.
3 . The method of claim 1 , wherein as a result of the adhesion promoter being applied to the surface, chemical bonds between benzene rings of the catechol group molecules and the package substrate are formed.
4 . The method of claim 1 , wherein the electronic component is attached prior to the adhesion promoter being applied to the surface.
5 . The method of claim 1 , wherein the electronic component is attached after to the adhesion promoter is applied to the surface.
6 . The method of claim 1 further comprising:
electrically coupling the electronic component to the package substrate prior to the adhesion promoter being applied to the surface.
7 . The method of claim 1 , wherein as a result of the encapsulating, benzene rings of at least some of the catechol group molecules are chemically bonded to both the package substrate and to the encapsulant.
8 . The method of claim 1 wherein as a result of the encapsulating, benzene rings of at least some of the catechol group molecules are chemically bonded to both the package substrate and to the encapsulant.
9 . The method of claim 1 wherein the surface is characterized as a surface of a metal of the package substrate.
10 - 20 . (canceled)
21 . A method comprising:
providing a package substrate;
applying a catechol group adhesion promoter to the package substrate;
attaching an electronic component to the package substrate;
forming a first catechol group adhesion promoted interface between the electronic component and the package substrate; and
bonding an encapsulant to a portion of the package substrate at a second catechol group adhesion promoted interface formed between the package substrate and the encapsulant.
22 . The method of claim 21 , wherein forming the adhesion promoted interfaces includes chemically bonding a plurality of benzene rings to a surface of the package substrate.
23 . The method of claim 22 , wherein at least some of the plurality of benzene rings are chemically bonded to the encapsulant.
24 . The method of claim 21 , further comprising:
forming a catechol group molecule between the encapsulant and the package substrate.
25 . The method of claim 24 , wherein the catechol group molecule is characterized as one of a group consisting of dihydroxybenzene, dopamine, alpha-methyldopamine, norepinephrine, dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and 5-hydroxydopamine.
26 . The method of claim 21 , wherein the encapsulant remains bonded to the package substrate at temperatures ranging between −80 degrees Celsius and 300 degrees Celsius.
27 . The method of claim 21 , wherein the second catechol group adhesion promoted interface is located at a metal surface of the package substrate.
28 . The method of claim 21 , further comprising:
electrically coupling the electronic component and the package substrate with a plurality of wire bonds, wherein the encapsulant is located on surfaces of the plurality of wire bonds.
29 . The method of claim 21 , wherein the first and second catechol group adhesion promoted interfaces are characterized as a self assembled monolayer interface.
30 . A method comprising:
providing a package substrate including a surface;
attaching an electronic device to a portion of the surface;
encapsulating the surface with an encapsulant;
forming a self assembled monolayer interface between the surface and the encapsulant and between the portion of the surface and the electronic device, the self assembled monolayer interface including a plurality of molecules each including a benzene ring chemically bonded to the surface and to the encapsulant.
31 . The method of claim 30 , wherein the surface is characterized as a metal.