IP Library Granted Patent US 9,812,418
Granted Patent B2
US 9,812,418 · App. 15/351,992 · Granted Nov 7, 2017

Electronic apparatus and method for fabricating the same

Inventors: Kozo Shimizu (Atsugi, JP); Seiki Sakuyama (Isehara, JP)
Assignee: FUJITSU LIMITED
H01L24/17B23K1/0008B23K1/0016B23K3/085B23K35/0244B23K35/262B23K35/264H01L23/3128H01L23/3675H01L23/488H01L23/49816H01L23/49822H01L23/49827H01L24/13H01L24/16H01L24/19H01L24/75H01L24/81H01L25/0655H01L25/0657H01L25/50H05K3/3463B23K2201/40B23K2201/42H01L23/145H01L23/3114H01L23/49838H01L24/20H01L24/73H01L2224/0401H01L2224/04105H01L2224/05082H01L2224/05144H01L2224/05147H01L2224/05155H01L2224/05567H01L2224/05624H01L2224/05647H01L2224/1146H01L2224/11334H01L2224/131H01L2224/13016H01L2224/13076H01L2224/13111H01L2224/13139H01L2224/13144H01L2224/13147H01L2224/13155H01L2224/13164H01L2224/1601H01L2224/16145H01L2224/16157H01L2224/16235H01L2224/16238H01L2224/16505H01L2224/16507H01L2224/24137H01L2224/24195H01L2224/293H01L2224/2919H01L2224/2929H01L2224/32225H01L2224/33181H01L2224/48091H01L2224/48106H01L2224/48227H01L2224/73204H01L2224/73253H01L2224/73265H01L2224/759H01L2224/75253H01L2224/75501H01L2224/75502H01L2224/81005H01L2224/8121H01L2224/81075H01L2224/81191H01L2224/81192H01L2224/81411H01L2224/81815H01L2224/81948H01L2224/81986H01L2225/06513H01L2924/014H01L2924/10252H01L2924/10253H01L2924/10271H01L2924/10329H01L2924/10335H01L2924/13091H01L2924/1579H01L2924/15311H01L2924/15313H01L2924/1659H01L2924/16235H01L2924/16251H01L2924/16747H01L2924/181H01L2924/19041H01L2924/19105H01L2924/3512H01L2924/35121H05K1/0203H05K1/09H05K1/113H05K3/3436H05K2201/0248H05K2201/09972H05K2201/1056H05K2203/1121H05K2203/304
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Quick Facts
Patent No.
US 9,812,418
App. No.
15/351,992
Granted
Nov 7, 2017
Kind
B2
Abstract

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Claims (10)

1. An electronic apparatus comprising:

a first electronic part with a first terminal;

a second electronic part with a second terminal opposite the first terminal; and

a joining portion that joins the first terminal and the second terminal,

wherein the joining portion includes

a portion containing at least a first metallic element and a second metallic element different from the first metallic element, and

an intermetallic compound containing the first metallic element and the second metallic element different from the first metallic element, the intermetallic compound extending in a direction in which the first terminal and the second terminal are opposite to each other,

the portion being around the intermetallic compound, and

wherein the first metallic element is Sn, and the second metallic element is one of Au, Cu, Ni, and Pd.

2. The electronic apparatus according to claim 1 , wherein the intermetallic compound is pole-shaped.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
Priority Claims (1)
JP 2013-254372 · Dec 9, 2013 · national
Continuity (3)
Continuation 15142690 · Apr 29, 2016
Continuation 14532032 · Nov 4, 2014
Related Publication 20170062373A1 · Mar 2, 2017