Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
A semiconductor device comprises a semiconductor die including a conductive layer. A first insulating layer is formed over the semiconductor die and conductive layer. An encapsulant is disposed over the semiconductor die. A compliant island is formed over the first insulating layer. An interconnect structure is formed over the compliant island. An under bump metallization (UBM) is formed over the compliant island. The compliant island includes a diameter greater than 5 μm larger than a diameter of the UBM. An opening is formed in the compliant island over the conductive layer. A second insulating layer is formed over the first insulating layer and compliant island. A third insulating layer is formed over an interface between the semiconductor die and the encapsulant. An opening is formed in the third insulating layer over the encapsulant for stress relief.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an encapsulant around the semiconductor die;
forming a plurality of compliant islands over the semiconductor die;
forming a compliant layer over an interface between the semiconductor die and encapsulant; and
forming a plurality of interconnect structures over the semiconductor die with each of the interconnect structures aligned with one of the compliant islands or over the compliant layer.
2. The method of claim 1 , further including:
forming an insulating layer over the compliant islands; and
forming the interconnect structures over the insulating layer.
3. The method of claim 2 , further including:
forming a conductive layer on the insulating layer; and
forming the plurality of interconnect structures on the conductive layer.
4. The method of claim 3 , further including:
forming an opening in the insulating layer and through one of the compliant islands to expose a contact pad of the semiconductor die; and
forming the conductive layer extending into the opening.
5. The method of claim 1 , further including forming the compliant layer to extend at least 20 μm beyond an edge of the semiconductor die.
6. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a compliant island over the semiconductor die;
forming an insulating layer over the compliant island with a surface of the insulating layer substantially planar over an entire width of the compliant island; and
forming an interconnect structure over the semiconductor die and aligned with the compliant island.
7. The method of claim 6 , further including forming the interconnect structure over the insulating layer.
8. The method of claim 6 , further including:
forming a conductive layer over the insulating layer; and
forming the interconnect structure over the conductive layer.
9. The method of claim 6 , wherein forming the interconnect structure includes forming a solder bump aligned with the compliant island.
10. The method of claim 6 , wherein the compliant island includes a footprint larger than a footprint of the interconnect structure.
11. The method of claim 6 , further including:
depositing an encapsulant around the semiconductor die; and
forming a compliant layer over an interface between the semiconductor die and encapsulant.
12. The method of claim 11 , further including forming an opening in the compliant layer.
13. A semiconductor device, comprising:
a semiconductor die;
a compliant island formed over the semiconductor die;
a conductive via formed through the compliant island; and
an interconnect structure formed over the compliant island and coupled to the semiconductor die through the conductive via.
14. The semiconductor device of claim 13 , further including an insulating layer formed over the compliant island with the interconnect structure over the insulating layer.
15. The semiconductor device of claim 14 , further including a conductive layer formed on the insulating layer with the interconnect structure formed on the conductive layer.
16. The semiconductor device of claim 13 , further including:
an encapsulant deposited around the semiconductor die; and
a compliant layer formed over an interface between the semiconductor die and encapsulant.
17. The semiconductor device of claim 16 , wherein the compliant layer extends at least 20 μm beyond an edge of the semiconductor die.
18. A semiconductor device, comprising:
a semiconductor die;
a compliant island over the semiconductor die, wherein the compliant island extends outside a footprint of the semiconductor die; and
an interconnect structure over the compliant island.
19. The semiconductor device of claim 18 , further including an insulating layer between the compliant island and interconnect structure.
20. The semiconductor device of claim 19 , further including a conductive layer between the insulating layer and interconnect structure.
21. The semiconductor device of claim 19 , wherein the interconnect structure includes a solder bump.
22. The semiconductor device of claim 18 , wherein the compliant island is larger than the interconnect structure in plan view.
23. The semiconductor device of claim 19 , wherein the insulating layer includes a planar surface across a width of the semiconductor die.
24. The method of claim 1 , further including forming the compliant islands and compliant layer by:
depositing a compliant material over the semiconductor die and encapsulant; and
patterning the compliant material into the compliant islands and compliant layer.
25. The method of claim 6 , further including forming the surface of the insulating layer substantially planar over an entire width of the semiconductor die.