IP Library Granted Patent US 10,111,367
Granted Patent B2
US 10,111,367 · App. 15/498,683 · Granted Oct 23, 2018

Liquid immersion cooling apparatus, liquid immersion cooling system, and control method of liquid immersion cooling apparatus

Inventors: Hiroyoshi Kodama (Isehara, JP); Hiroshi Endo (Atsugi, JP); Yukiko Wakino (Sagamihara, JP); Satoshi Inano (Minoh, JP); Hiroyuki Fukuda (Yokohama, JP)
Assignee: FUJITSU LIMITED
H05K7/20836H05K7/20236H05K7/20772H05K7/20818
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Quick Facts
Patent No.
US 10,111,367
App. No.
15/498,683
Granted
Oct 23, 2018
Kind
B2
Abstract

A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that accommodates a cooling liquid and the electronic device to be immersed in the cooling liquid, a wall that is disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device, and a drive mechanism that moves a position of the protrusion along the electronic device.

Claims (27)

1. A liquid immersion cooling apparatus comprising:

a liquid immersion tank that accommodates a cooling liquid and an electronic device including a heat generating element to be immersed in the cooling liquid within the liquid immersion tank, the liquid immersion tank being coupled to a heat exchanger that cools the cooling liquid from the liquid immersion tank;

a wall that is disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device;

a pump that circulates the cooling liquid between the liquid immersion tank and the heat exchanger: and

a wall driver including a winder that moves a position of the protrusion formed on the wall along the electronic device.

2. The liquid immersion cooling apparatus according to claim 1 , wherein the wall driver moves the wall when moving the position of the protrusion.

3. The liquid immersion cooling apparatus according to claim 1 , wherein the wall driver moves only the protrusion of the wall when moving the position of the protrusion.

4. The liquid immersion cooling apparatus according to claim 1 , further comprising:

a fan disposed in the liquid immersion tank to send the cooling liquid between the heat generating element and the protrusion.

5. The liquid immersion cooling apparatus according to claim 4 , wherein the fan is disposed on a bottom portion of the liquid immersion tank.

6. A liquid immersion cooling system comprising:

a liquid immersion tank that accommodates a cooling liquid and an electronic device including a heat generating element, the electronic device being immersed in the cooling liquid within the liquid immersion tank;

a wall disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device;

a pump that circulates the cooling liquid between the liquid immersion tank and a heat exchanger; and

a wall driver including a winder that moves a position of the protrusion formed on the wall along the electronic device.

7. The liquid immersion cooling system according to claim 6 , further comprising:

a temperature sensor that detects a temperature of the heat generating element; and

a control device that controls the wall driver based on an output of the temperature sensor.

8. The liquid immersion cooling system according to claim 6 , wherein the cooling liquid is a fluorine-based inert liquid.

9. The liquid immersion cooling system according to claim 6 , wherein the protrusion moves in a direction parallel to a flow direction of the cooling liquid near the electronic device.

10. A control method of a liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the method comprising:

immersing the electronic device in a cooling liquid within an immersion tank and circulating the cooling liquid between the liquid immersion tank and a heat exchanger;

disposing a wall in the liquid immersion tank, the wall having a protrusion protruding toward the electronic device; and

moving a position of the protrusion formed on the wall by a wall driver including a winder depending on a temperature of the heat generating element.

11. The control method according to claim 10 , wherein a control device acquires the temperature of the heat generating element while moving the protrusion, and based on the acquired temperature, the control device disposes the protrusion at a position where the temperature of the heat generating element becomes the lowest.

12. The liquid immersion cooling apparatus according to claim 1 , wherein the wall driver further includes a pulley.

13. The liquid immersion cooling apparatus according to claim 1 , wherein the wall driver further includes a roller, and a lead screw.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2017
From: KODAMA, HIROYOSHI; ENDO, HIROSHI; WAKINO, YUKIKO; INANO, SATOSHI; FUKUDA, HIROYUKI
To: FUJITSU LIMITED
Reel/Frame 042191/0165 →
Priority Claims (1)
JP 2016-109846 · Jun 1, 2016 · national
Continuity (1)
Related Publication 20170354066A1 · Dec 7, 2017
Cited By (4)
US 12,224,420 US 12,363,859 US 12,363,865 US 12,575,060