IP Library › Granted Patent US 12,224,420
Granted Patent B2
US 12,224,420 · App. 17/293,701 · Granted Feb 11, 2025

Device for thermal regulation of an electronic component

Inventors: Kamel Azzouz (Le Mesnil Saint Denis, FR); Amrid Mammeri (Le Mesnil Saint Denis, FR); Sébastien Garnier (Le Mesnil Saint Denis, FR); Imad Chelali (Le Mesnil Saint Denis, FR)
Assignee: VALEO SYSTEMES THERMIQUES
H01M10/6568F28D9/0037F28F3/12H01M10/613H01M10/625H01M10/6554H01M10/6556H01M10/6569H05K7/20318H05K7/20327F28D2021/0029F28F2250/08F28F2275/04H01M2220/20
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,224,420
App. No.
17/293,701
Granted
Feb 11, 2025
Kind
B2
Abstract

The invention concerns a device for thermal regulation ( 2 ), in particular cooling, for an electronic component ( 103 ), in particular a battery, the temperature of which must be controlled, the electronic component ( 103 ) being in particular capable of giving off heat during its operation, the thermal regulation device comprising at least one first circuit ( 4 ) configured to allow the circulation of a heat transfer fluid; at least one second circuit ( 5 ) configured to transport a dielectric fluid, this second circuit comprising at least one outlet for delivering the dielectric fluid towards the electronic component; at least one first circuit ( 4 ) and at least one second circuit ( 5 ) being arranged so that the first circuit is in thermal interaction with the fluid delivered via the at least one outlet of the second circuit.

Claims (29)

1. A thermal regulation device for thermally regulating electronic components giving off heat during operation, the thermal regulation device comprising:

at least one first circuit configured to allow a circulation of a heat transfer fluid; and

at least one second circuit configured to convey a dielectric fluid, wherein the at least one second circuit comprises at least one outlet that distributes the dielectric fluid in a direction of the electronic components;

at least one plate incorporating the at least one first circuit to form at least one condenser plate configured to liquefy the dielectric fluid, wherein the at least one condenser plate is formed of two separate shells placed against one another; and

at least one plate incorporating the at least one second circuit and identical to the at least one plate incorporating the at least one first circuit;

wherein the thermal regulation device is configured such that at least a portion of the at least one first circuit and at least a portion of the at least one second circuit are in thermal contact with each other.

2. The thermal regulation device as claimed in claim 1 , wherein the at least one second circuit extends within the at least one condenser plate such that it is surrounded by branches forming part of the at least one first circuit.

3. The thermal regulation device as claimed in claim 1 , wherein the at least one second circuit is formed in a peripheral zone of the at least one condenser plate, such as to leave clear a central zone of the at least one condenser plate for the at least one first circuit.

4. The thermal regulation device as claimed in claim 1 , wherein the at least one first circuit and the at least one second circuit are arranged on either side of the at least one condenser plate, which comprises on a first face a plurality of cavities and on an opposite face a plurality of hollows, said plurality of cavities and hollows being covered by at least one cover and at least one cap respectively, so that the plurality of cavities, respectively the hollows, form the at least one first circuit and the at least one second circuit, respectively.

5. The thermal regulation device as claimed in claim 1 , wherein the at least one plate incorporating the at least one second circuit is secant to the at least one plate incorporating the at least one first circuit.

6. The thermal regulation device as claimed in claim 1 , wherein at least one of the two separate shells comprises a boss which defines a cavity forming part of the at least one first circuit or part of the at least one second circuit.

7. The thermal regulation device as claimed in claim 1 , wherein at least one condenser plate comprises:

at least one main wall provided with a dielectric fluid inlet as well as a heat transfer fluid inlet and a heat transfer fluid outlet, between which the at least one first circuit extends; and

a plurality of secondary walls projecting from the at least one main wall, including a first lateral secondary wall provided at a first longitudinal end of the at least one main wall, a second lateral secondary wall provided at a second longitudinal end of the at least one main wall and an intermediate secondary wall that is interposed between the first lateral secondary wall and the second lateral secondary wall, the intermediate secondary wall helping to define, with part of the at least one main wall and one of the first lateral secondary wall and the second lateral secondary wall, two chambers for receiving electronic components.

8. The thermal regulation device as claimed in claim 7 , wherein the at least one first circuit is formed at least in the at least one main wall.

9. The thermal regulation device as claimed in claim 7 , wherein the at least one second circuit is formed in at least one secondary wall.

10. The thermal regulation device as claimed in claim 1 , wherein each of the at least one outlet has a spray nozzle, each spray nozzle is oriented toward one of the electronic components.

11. The thermal regulation device as claimed in claim 10 , wherein spray nozzles are placed on each of the opposite faces of at least one condenser plate.

12. The thermal regulation device as claimed in claim 1 , wherein the at least one second circuit is formed by a conduit produced separately from the at least one condenser plate and attached to a face of the at least one condenser plate which faces a chamber for receiving at least one the electronic components.

13. The thermal regulation device as claimed in claim 12 , wherein the conduit forming the at least one second circuit has a dielectric fluid inlet end which is rigidly secured to the at least one condenser plate by brazing.

14. The thermal regulation device as claimed in claim 12 , wherein the conduit forming the at least one second circuit is secured to the at least one condenser plate by securing studs.

15. The thermal regulation device as claimed in claim 12 , wherein the conduit forming the at least one second circuit has a substantially flat shape, and is arranged in a plane parallel to the at least one condenser plate.

16. The thermal regulation device as claimed in claim 12 , wherein the conduit forming the at least one second circuit has bent portions extending in a plane substantially perpendicular to the plane of the at least one condenser plate.

17. The thermal regulation device as claimed in claim 1 , wherein the at least one first circuit and the at least one second circuit are respectively formed by a conduit arranged in a vicinity of a corresponding electronic component.

18. A thermal regulation assembly comprising:

the thermal regulation device as claimed in claim 1 ;

the electronic components stacked in a stacking direction and associated with the at least one first circuit and the at least one second circuit;

wherein the thermal regulation device comprises a recovery tray provided with a discharge pipe arranged in an extension of the electronic components in the stacking direction and configured to receive the dielectric fluid coming from each condenser; and

wherein the thermal regulation device comprises a recirculation duct, in fluid communication with the discharge pipe, equipped with a pump for conveying the dielectric fluid to at least one dielectric fluid inlet of the at least one second circuits.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2021
From: AZZOUZ, KAMEL; MAMMERI, AMRID; GARNIER, SÉBASTIEN; CHELALI, IMAD
To: VALEO SYSTEMES THERMIQUES
Reel/Frame 056826/0816 →
Priority Claims (4)
FR 1860652 · Nov 16, 2018 · national
FR 1905091 · May 15, 2019 · national
FR 1905092 · May 15, 2019 · national
FR 1906505 · Jun 18, 2019 · national
Continuity (1)
Related Publication 20220109201A1 · Apr 7, 2022
References Cited (16)
US 5522452A · Mizuno · 1996 [cited by examiner]
US 5907473A · Przilas · 1999 [cited by examiner]
US 5943211A · Havey et al. · 1999 [cited by applicant]
US 6357517B1 · Osakabe · 2002 [cited by examiner]
US 6662859B2 · Strahle · 2003 [cited by examiner]
US 10111367B2 · Kodama · 2018 [cited by examiner]
US 20060174643A1 · Ostrom · 2006 [cited by examiner]
US 20090283248A1 · Nilsson · 2009 [cited by examiner]
US 20100039773A1 · Tilton · 2010 [cited by examiner]
US 20180145382A1 · Harris et al. · 2018 [cited by applicant]
CN 101534627A · 2009 [cited by applicant]
CN 102548780A · 2012 [cited by applicant]
CN 203279429U · 2013 [cited by applicant]
FR 3037727A3 · 2016 [cited by applicant]
Office Action issued in counterpart Chinese Patent Application No. CN 201980089328.6 mailed Dec. 4, 2023 (15 pages). [cited by applicant]
International Search Report with Written Opinion in corresponding International Application No. PCT/FR2019/052094, mailed Jan. 28, 2020 (10 pages). [cited by applicant]