Wafer-level testing of lasers attached to photonics chips
Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.
1. A structure comprising:
a first photonics chip including a first waveguide, a second waveguide, a third waveguide, a first optical tap coupling the second waveguide to the first waveguide, a second optical tap coupling the third waveguide to the first waveguide, a first photodetector coupled to the second waveguide, and a first grating coupler coupled to the third waveguide; and
a first laser attached to the first photonics chip, the first laser configured to generate laser light directed by the first waveguide to the first optical tap and the second optical tap.
2. The structure of claim 1 wherein the first photonics chip includes a fourth waveguide, a second photodetector coupled to the fourth waveguide, and a third optical tap coupling the fourth waveguide to the second waveguide.
3. The structure of claim 1 wherein the first photonics chip includes an absorber, and the first waveguide is configured to couple the first laser to the absorber.
4. The structure of claim 1 further comprising:
a substrate including the first photonics chip, a second photonics chip, and a scribe line separating from the first photonics chip from the second photonics chip.
5. A structure comprising:
a first photonics chip including a first waveguide, a second waveguide, a first optical tap coupling the second waveguide to the first waveguide, and a first photodetector coupled to the second waveguide; and
a first laser attached to the first photonics chip, the first laser configured to generate laser light directed by the first waveguide to the first optical tap,
wherein the first photonics chip includes an edge coupler coupling the first laser to the first waveguide and a modulator coupled to the first waveguide, and the first optical tap is coupled to the first waveguide at a first position between the edge coupler and the modulator.
6. The structure of claim 5 wherein the first photonics chip includes a third waveguide, a second photodetector coupled to the third waveguide, a second optical tap coupling the third waveguide to the first waveguide at a second position, and the modulator is positioned between the first position and the second position.
7. The structure of claim 5 wherein the first photonics chip includes a third waveguide, a grating coupler coupled to the third waveguide, and a second optical tap coupling the third waveguide to the second waveguide.
8. The structure of claim 7 wherein the second optical tap is configured to direct about fifty percent of the laser light from the second waveguide to the third waveguide.
9. The structure of claim 5 wherein the first photonics chip includes a third waveguide, a grating coupler coupled to the third waveguide, and a second optical tap coupling the third waveguide to the first waveguide at a second position between the edge coupler and the modulator.
10. The structure of claim 9 wherein the second optical tap is configured to direct about five percent of the laser light from the first waveguide to the third waveguide.
11. The structure of claim 5 wherein the first photonics chip includes a third waveguide, a second photodetector coupled to the third waveguide, and a second optical tap coupling the third waveguide to the second waveguide.
12. The structure of claim 11 wherein the second optical tap is configured to direct about fifty percent of the laser light from the second waveguide to the third waveguide.
13. The structure of claim 5 further comprising:
a substrate including the first photonics chip, a second photonics chip, and a scribe line separating from the first photonics chip from the second photonics chip.
14. The structure of claim 5 wherein the first optical tap is configured to direct about five percent of the laser light from the first waveguide to the second waveguide.
15. A method of testing a laser attached to a first photonics chip at a wafer level, the method comprising:
ramping a first electrical current supplied to the laser such that an optical power of laser light that is output by the laser increases;
directing a first portion of the laser light to a photodetector on the first photonics chip, wherein the first photonics chip and a second photonics chip are located on a substrate;
measuring a second electrical current generated by the photodetector in response to the first portion of the laser light as a function of the first electrical current; and
singulating the first photonics chip and the second photonics chip from the substrate.
16. The method of claim 15 further comprising:
directing a second portion of the laser light to a grating coupler on the first photonics chip; and
measuring an optical spectrum generated by the grating coupler in response to the second portion of the laser light.
17. The method of claim 15 further comprising:
supplying a third electrical current to the laser such that an optical power output by the laser is approximately constant;
directing a second portion of the laser light to a grating coupler on the first photonics chip; and
measuring an optical spectrum generated by the grating coupler in response to the second portion of the laser light.
18. The method of claim 17 further comprising:
measuring a fourth electrical current generated by the photodetector in response to the first portion of the laser light while the third electrical current is supplied to the laser.