Apparatus and method for thermal insulation of high-temperature pressure sensors
A high-temperature pressure sensor includes a pressure sensor device and a heater shell body external to the pressure sensor device for providing heat to the pressure sensor device. A particle-generating insulation material is encapsulated within an encapsulation material to form an encapsulated insulation structure comprising the particle-generating insulation material within the encapsulation material, such that the encapsulation material substantially contains particles generated by the particle-generating insulation material within encapsulated insulation structure. The encapsulated insulation structure is disposed adjacent to an exterior of the heater shell body.
1. A high-temperature pressure sensor, comprising:
a pressure sensor device;
a heater shell body external to the pressure sensor device for providing heat to the pressure sensor device;
a particle-generating insulation material; and
an encapsulation material encapsulating the particle-generating insulation material to form an encapsulated insulation structure comprising the particle-generating insulation material within the encapsulation material, such that the encapsulation material contains particles generated by the particle-generating insulation material within encapsulated insulation structure, the encapsulated insulation structure being disposed adjacent to an exterior of the heater shell body.
2. The pressure sensor of claim 1 , wherein the particle-generating insulation material comprises one of aerogel material, microporous silica, and pyrogenic (fumed) silica.
3. The pressure sensor of claim 1 , wherein the encapsulation material comprises a fluoropolymer material.
4. The pressure sensor of claim 1 , wherein the encapsulation material comprises a thermoplastic material.
5. The pressure sensor of claim 4 , wherein the thermoplastic material is a thermoplastic film.
6. The pressure sensor of claim 4 , wherein the thermoplastic material comprises at least one material selected from polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), ethylene tetrafluoroethylene (ETFE), polyfluoroethylenepropylene (FEP), tetrafluoroethylene/hexafluoropropylene/vinylidene fluoride (THV), polyvinylidene fluoride (PVDF), ethylenechlorotrifluoroethylene (ECTFE), polyether ether ketone (PEEK), polyimide (PI) and polyethylenimine (PEI).
7. The pressure sensor of claim 4 , wherein the thermoplastic material has a thickness in the range of 0.0005 to 0.0500 inch.
8. The pressure sensor of claim 1 , wherein the encapsulation material comprises a metallized film.
9. The pressure sensor of claim 1 , wherein the encapsulation material is in sheet form.
10. The pressure sensor of claim 1 , wherein the encapsulation material is in vacuum-molded form.
11. The pressure sensor of claim 1 , wherein the encapsulation material is in pressure-molded form.
12. The pressure sensor of claim 1 , wherein the encapsulation material is in matched die molded form.
13. The pressure sensor of claim 1 , wherein the encapsulation material is in blow-molded form.
14. The pressure sensor of claim 1 , wherein the encapsulation material comprises a heat seal for sealing the particle-generating insulation material within the encapsulation material.
15. The pressure sensor of claim 1 , wherein the encapsulation material comprises a laser weld for sealing the particle-generating insulation material within the encapsulation material.
16. The pressure sensor of claim 1 , wherein the encapsulation material comprises an adhesive bond for sealing the particle-generating insulation material within the encapsulation material.
17. The pressure sensor of claim 1 , wherein the encapsulation material comprises a tape seal for sealing the particle-generating insulation material within the encapsulation material.
18. The pressure sensor of claim 1 , wherein the encapsulation material comprises a seal such that the particle-generating insulation material is sealed within the encapsulation material, and wherein an interior of the encapsulation material is at least partially evacuated.
19. The pressure sensor of claim 18 , wherein the encapsulation material comprises a one-way valve for facilitating at least partial evacuation of the interior of the encapsulation material.
20. The pressure sensor of claim 18 , wherein the one-way valve is adapted to facilitate the at least partial evacuation of the interior of the encapsulation material by vacuum pumping.
21. The pressure sensor of claim 18 , wherein the one-way valve is adapted to facilitate the at least partial evacuation of the interior of the encapsulation material by heating of the porous insulation material and adjacent gas.
22. The pressure sensor of claim 1 , wherein the encapsulation material comprises a porous region allowing gas migration in and out of an interior of the encapsulation material, the porous region having openings having a size selected to contain particles generated by the particle-generating insulation within the encapsulation material.
23. The pressure sensor of claim 22 , wherein the porous region comprises a porous membrane.
24. The pressure sensor of claim 22 , wherein the porous region comprises one or more laser-drilled holes.
25. A method of making a high-temperature pressure sensor, comprising:
providing a heater shell body external to a pressure sensor device for providing heat to the pressure sensor device;
encapsulating a particle-generating insulation material within an encapsulation material to form an encapsulated insulation structure comprising the particle-generating insulation material within the encapsulation material, such that the encapsulation material contains particles generated by the particle-generating insulation material within encapsulated insulation structure; and
disposing the encapsulated insulation structure adjacent to an exterior of the heater shell body.
26. The method of claim 25 , wherein the particle-generating insulation material comprises one of aerogel material, microporous silica, and pyrogenic (fumed) silica.
27. The method of claim 25 , wherein the encapsulation material comprises a fluoropolymer material.
28. The method of claim 25 , wherein the encapsulation material comprises a thermoplastic material.
29. The method of claim 28 , wherein the thermoplastic material is a thermoplastic film.
30. The method of claim 28 , wherein the thermoplastic material comprises at least one material selected from polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), ethylene tetrafluoroethylene (ETFE), polyfluoroethylenepropylene (FEP), tetrafluoroethylene/hexafluoropropylene/vinylidene fluoride (THV), polyvinylidene fluoride (PVDF), ethylenechlorotrifluoroethylene (ECTFE), polyether ether ketone (PEEK), polyimide (PI) and polyethylenimine (PEI).
31. The method of claim 28 , wherein the thermoplastic material has a thickness in the range of 0.0005 to 0.0500 inch.
32. The method of claim 25 , wherein the encapsulation material comprises a metallized film.
33. The method of claim 25 , wherein the encapsulation material is in sheet form.
34. The method of claim 25 , wherein the encapsulation material is in vacuum-molded form.
35. The method of claim 25 , wherein the encapsulation material is in pressure-molded form.
36. The method of claim 25 , wherein the encapsulation material is in matched die molded form.
37. The method of claim 25 , wherein the encapsulation material is in blow-molded form.
38. The method of claim 25 , further comprising heat sealing the encapsulation material to seal the porous insulation material within the encapsulation material.
39. The method of claim 25 , further comprising laser welding the encapsulation material to seal the particle-generating insulation material within the encapsulation material.
40. The method of claim 25 , further comprising adhesively bonding the encapsulation material to seal the particle-generating insulation material within the encapsulation material.
41. The method of claim 25 , further comprising applying a tape to the encapsulation material to seal the particle-generating insulation material within the encapsulation material.
42. The method of claim 25 , further comprising:
sealing the particle-generating insulation material within the encapsulation material; and
at least partially evacuating an interior of the encapsulation material.
43. The method of claim 42 , wherein the encapsulation material comprises a one-way valve for facilitating at least partially evacuating the interior of the encapsulation material.
44. The method of claim 42 , wherein at least partially evacuating the interior of the encapsulation material comprises vacuum pumping the interior of the encapsulation material via the one-way valve.
45. The method of claim 42 , wherein at least partially evacuating the interior of the encapsulation material comprises heating the particle-generating insulation material and adjacent gas.
46. The method of claim 25 , further comprising forming a porous region in the encapsulation material to allow gas migration in and out of an interior of the encapsulation material, the porous region having openings having a size selected to contain particles generated by the particle-generating insulation within the encapsulation material.
47. The method of claim 46 , wherein forming the porous region in the encapsulation material comprises forming the encapsulation material with a porous membrane.
48. The method of claim 46 , wherein forming the porous region in the encapsulation material comprises laser-drilling a plurality of holes in the encapsulation material.
49. The method of claim 25 , further comprising forming an opening in the encapsulation material to allow gas migration in and out of an interior of the encapsulation material.