IP Library Granted Patent US 10,446,494
Granted Patent B2
US 10,446,494 · App. 16/189,174 · Granted Oct 15, 2019

Manufacturing method of wiring structure and wiring structure

Inventor: Motonobu Sato (Isehara, JP)
Assignee: FUJITSU LIMITED
H01L23/53276H01L21/76802H01L21/76877H01L21/76883H01L21/76886H01L23/485H01L23/528H01L23/53295H01L21/7681H01L2221/1094
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Quick Facts
Patent No.
US 10,446,494
App. No.
16/189,174
Granted
Oct 15, 2019
Kind
B2
Abstract

A trench is formed in an insulating film, carbon is formed on the insulating film to fill an inside of the trench, a catalytic material is formed on the carbon, heat treatment is performed on the carbon to turn the carbon into graphenes which are stacked in a plurality of layers, and the catalytic material and a part of the graphenes on the insulating film are removed to make the graphenes remain only in the trench.

Claims (16)

1. A manufacturing method of a wiring structure, comprising:

forming a trench in an insulating film;

forming carbon on the insulating film to fill an inside of the trench;

forming a catalytic material on the carbon;

performing heat treatment on the carbon to turn the carbon into graphenes which are stacked in a plurality of layers; and

removing the catalytic material and a part of the graphenes on the insulating film, to make the graphenes remain only in the trench.

2. The manufacturing method of the wiring structure according to claim 1 , wherein

the inside of the trench of the insulating film is directly filled with the graphenes.

3. The manufacturing method of the wiring structure according to claim 1 , wherein

the trench is a connection hole or a wiring trench.

4. The manufacturing method of the wiring structure according to claim 1 , wherein

the trench is made of a connection hole and a wiring trench which are integrally formed.

5. The manufacturing method of the wiring structure according to claim 1 , wherein

the graphenes are subjected to intercalation or doping using molecules of a different kind.

6. The manufacturing method of the wiring structure according to claim 1 , wherein

the catalytic material is formed to have a thickness in a range from a thickness equivalent to a thickness of the carbon to a thickness which is twice the thickness of the carbon.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2019
From: SATO, MOTONOBU
To: FUJITSU LIMITED
Reel/Frame 049738/0489 →
Continuity (2)
Division 14661585 · Mar 18, 2015
Related Publication 20190096818A1 · Mar 28, 2019