IP Library Granted Patent US 10,767,940
Granted Patent B2
US 10,767,940 · App. 16/236,977 · Granted Sep 8, 2020

Heat exchanger system and method of operation

Inventors: Abbas A. Alahyari (Glastonbury, CT); Miad Yazdani (South Windsor, CT); Craig R. Walker (S. Glastonbury, CT)
Assignee: HAMILTON SUNSTRAND CORPORATION
F28F13/04F28B9/08F28D1/04F28F13/16F28F17/00F28F17/005F28F19/02F28F27/00F25B21/02F28F2245/00F28F2245/04
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Quick Facts
Patent No.
US 10,767,940
App. No.
16/236,977
Granted
Sep 8, 2020
Kind
B2
Abstract

A method of operating a heat exchanger is disclosed in which an electric field is applied to a hydrophobic surface having condensed water droplets thereon to reduce a contact angle between the individual droplet surfaces and the hydrophobic surface, and to increase droplet surface energy to a second surface energy level. The electric field is removed to increase the contact angle between the individual droplet surfaces and the hydrophobic surface, and to reduce droplet surface energy to a third surface energy level. The third surface energy level is greater than the first surface energy level and greater than a surface energy level for a free droplet. A portion of the droplet surface energy is converted to kinetic energy to detach droplets from the hydrophobic surface. The detached droplets are removed from the heat rejection side fluid flow path.

Claims (15)

1. A heat exchanger system, comprising

a heat exchanger comprising a heat rejection side fluid flow path and a hydrophobic surface in thermal communication with a heat absorption side of the heat exchanger and in fluid communication with the heat rejection side flow path; and

a power source, electrodes, and a controller arranged to apply an electrical field to the hydrophobic surface,

wherein the controller is configured to apply the electric field to reduce a contact angle between condensate droplet surfaces and the hydrophobic surface and increase droplet surface energy to a second level greater than a first surface energy level for condensate droplets on the hydrophobic surface in the absence of an electric field, and to remove the electric field to increase the contact angle between the individual droplet surfaces and the hydrophobic surface and reduce droplet surface energy to a third surface energy level greater than the first surface energy level and greater than a surface energy level for a free droplet, and further wherein:

the controller is configured to apply an electrostatic charge to contaminants in the gas to promote capture of the contaminants by the droplets, or

the controller is configured to apply the electric field in response to a pressure differential between an inlet of the heat rejection side fluid flow path and an outlet of the heat rejection side fluid flow path, or

the controller is configured to apply the electric field in response to a temperature differential between a temperature of the hydrophobic surface and an ambient due point temperature higher than the hydrophobic surface temperature.

2. The system of claim 1 , wherein the controller is reconfigured to apply an electric field to impart an electrostatic charge to contaminants in the heat rejection side fluid flow path.

3. The system of claim 1 wherein the controller is further configured to apply the electric field in response to: (i) a pressure differential between a heat rejection side fluid flow path inlet and outlet, (ii) a pressure differential between a heat rejection side fluid flow path inlet and outlet, or (iii) a differential between a temperature of the hydrophobic surface and an ambient dew point temperature higher than the hydrophobic surface temperature.

4. The system of claim 1 wherein the controller is further configured to apply the electric field in a pulsed cycle pattern comprising alternating on and off periods wherein the duration of the off period is equal to or longer than the duration of the on period.

5. The system of claim 1 , wherein the hydrophobic surface is disposed on heat exchanger fins in thermal communication with the heat exchanger heat absorption side and in fluid communication with the heat rejection side fluid flow path.

6. The system of claim 5 , wherein the heat exchanger fins individually comprise a portion comprising a hydrophilic surface.

7. The system of claim 6 , wherein the hydrophobic surface comprises hydrophobic microstructural or nanostructural surface features.

8. The system of claim 1 , wherein the hydrophobic surface comprises a hydrophobic coating disposed on a heat exchanger surface in thermal communication with the heat exchanger heat absorption side and in fluid communication with the heat rejection side fluid flow path.

9. The system of claim 1 , wherein the heat exchanger hydrophobic surface comprises a heat exchanger structural feature formed from a hydrophobic polymer composition.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2019
From: ALAHYARI, ABBAS A.; YAZDANI, MIAD; WALKER, CRAIG R.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 047878/0576 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2019
From: UNITED TECHNOLOGIES CORPORATION
To: HAMILTON SUNDSTRAND CORPORATION
Reel/Frame 047878/0596 →
Continuity (3)
Continuation 15631657 · Jun 23, 2017
Provisional Application 62354571 · Jun 24, 2016
Related Publication 20190137198A1 · May 9, 2019