Middle of line gate structures
The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line gate structures and methods of manufacture. The structure includes: a plurality of adjacent gate structures; a bridged gate structure composed of a plurality of the adjacent gate structures; source and drain regions adjacent to the bridged gate structure and comprising source and drain metallization features; and contacts to the bridged gate structure and the source and drain metallization features.
1. A structure, comprising:
a first gate structure and a second gate structure separated from each other by a bridged gate structure, the bridged gate structure comprising a third gate structure and a fourth gate structure connected to one another by a gate connector, and the first gate structure and second gate structure being devoid of the gate connector;
source and drain regions adjacent to the bridged gate structure and comprising source and drain metallization features; and
contacts to the bridged gate structure and the source and drain metallization features.
2. The structure of claim 1 , wherein the bridged gate structure is an H-shape.
3. The structure of claim 1 , wherein the first, second, third and fourth gate structures are finFET gate structures.
4. The structure of claim 3 , wherein the source and drain metallization features extend across fin structures of the finFET gate structures.
5. The structure of claim 1 , wherein the contacts are formed on each of the first, second, third and fourth gate structures.
6. The structure of claim 1 , wherein the gate connector is comprised of a conductive gate material.
7. The structure of claim 1 , further comprising a fifth gate structure, wherein the second gate structure is located between the fifth gate structure and the bridged gate structure, and the fifth gate structure is wider than each of the first, second, third and fourth gate structures.
8. The structure of claim 7 , further comprising a sixth gate structure, wherein the fifth gate structure is located between the sixth gate structure and the second gate structure, and wherein the sixth gate structure is wider than each of the first, second, third and fourth gate structures.
9. The structure of claim 8 , wherein the width of each of the fifth and sixth gate structures is between 80 nm-250 nm and the width of each of the first to fourth gate structures is between 5 nm-40 nm.
10. A structure, comprising:
first, second, third and fourth gate structures, each comprising source/drain regions, gate materials, sidewall spacers and a capping material on the gate materials;
a bridge gate structure comprising the third and fourth gate structures, the bridge gate structure located between the first gate structure and the second gate structure, the bridged gate structure comprising a gate connector located in middle portions of the third gate structure and the fourth gate structure connecting the third gate structure and the fourth gate structure to one another, and the first and second gate structures being devoid of the gate connector;
a plurality of source and drain metallization features in electrical contact with the source/drain regions; and
a contact on the bridge gate structure.
11. The structure of claim 10 , wherein the bridge structure provides electrical contact between gate material of the third and fourth gate structures.
12. The structure of claim 10 , wherein the first, second, third and fourth gate structures each comprises a gate dielectric, a workfunction metal and a gate metal.
13. The structure of claim 10 , wherein the contact is directly on the gate material of the third and fourth gate structures.
14. The structure of claim 10 , wherein the source and drain metallization features extend alongside the contact.
15. The structure of claim 10 , wherein the first, second, third and fourth gate structures are finFET gate structures.
16. The structure of claim 15 , wherein the source and drain metallization features extend to opposing fins of the finFET gate structures.
17. The structure of claim 16 , further comprising contacts to the source and drain metallization features which extend to opposing fins.
18. The structure of claim 17 , wherein a fill material of the source and drain metallization features is below the contact.
19. A method, comprising:
forming first, second, third and fourth gate structures, each comprising source/drain regions, gate materials, sidewall spacers and a capping material on the gate materials;
forming a bridge gate structure comprising the third gate structure and the fourth gate structure, the bridge gate structure located between the first gate structure and the second gate structure, the bridged gate structure comprising a gate connector connecting the third gate structure and the fourth gate structure, and the first and second gate structures being devoid of the gate connector
forming a plurality of source and drain metallization features in electrical contact with the source/drain regions; and
forming a contact on the bridge gate structure.