IP Library Granted Patent US 10,805,124
Granted Patent B2
US 10,805,124 · App. 16/700,028 · Granted Oct 13, 2020

Methods and apparatus for an interface

Inventors: Athar Ali Khan. P (Bangalore, IN); Manish Kumar Viswkarma (Azamgarh, IN)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H04L25/028H04L5/14H04L25/0292
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,805,124
App. No.
16/700,028
Granted
Oct 13, 2020
Kind
B2
Abstract

Various embodiments of the present technology may provide methods and apparatus for an interface. The interface may be configured as a low-voltage, bi-directional channel redriver having a transmitter and a receiver that share input pads and output pads. The interface may provide for selective biasing of the transmitter and receiver using a switching circuit and a resistance circuit connected to the channel's input and output pads.

Claims (68)

1. An interface circuit, comprising:

a receiver and a transmitter, wherein the transmitter and receiver share:

a first pair of I/O pads; and

a second pair of I/O pads; and

at least one switching circuit connected to at least one of the first pair and second pair of I/O pads and configured to selectively bias the at least one pair of I/O pads according to a plurality of voltages.

2. The interface circuit according to claim 1 , further comprising a first resistance circuit and a second resistance circuit, wherein each of the first and second resistance circuits comprises a plurality of resistors.

3. The interface circuit according to claim 2 , wherein:

the first resistance circuit is directly connected to:

a first I/O pad from the first pair of I/O pads; and

a second I/O pad from the first pair of I/O pads; and

the second resistance circuit is directly connected to:

a first I/O pad from the second pair of I/O pads; and

a second I/O pad from the second pair of I/O pads.

4. The interface circuit according to claim 2 , wherein:

the first resistance circuit comprises:

a first resistive element connected to a second I/O pad from the first pair of I/O pads and

a second resistive element connected to a first I/O pad from the first pair of I/O pads; and

the second resistance circuit comprises:

a third resistive element connected to a first I/O pad from the second pair of I/O pads; and

a fourth resistive element connected to a second I/O pad from the second pair of I/O pads.

5. The interface circuit according to claim 1 , wherein each voltage from the plurality of voltages is less than 3.0 volts.

6. The interface circuit according to claim 1 , wherein the switching circuit comprises a plurality of switching devices.

7. The interface circuit according to claim 1 , further comprising:

a first switching circuit configured to connect the first pair of I/O pads to a first voltage from the plurality of voltages; and

a second switching circuit configured to connect the second pair of I/O pads to a second voltage from the plurality of voltages.

8. The interface circuit according to claim 1 , wherein the interface circuit is configured to operate in a high-speed mode and a power-saving mode.

9. The interface circuit according to claim 1 , wherein:

an input terminal of the transmitter and an output terminal of the receiver share a first pad from the first pair of I/O pads; and

an output terminal of the transmitter and an input terminal of the receiver share a first pad from the second pair of I/O pads.

10. A method for operating an interface circuit having a receiver and a transmitter, comprising:

activating the transmitter, comprising:

operating in a first mode, comprising:

biasing a first pair of I/O pads; and

biasing a second pair of I/O pads differently from the first pair of I/O pads;

operating in a second mode, comprising:

equally biasing the first pair of I/O pads and second pair of I/O pads;

activating the receiver, comprising:

operating in the first mode, comprising:

biasing the first pair of I/O pads; and

biasing the second pair of I/O pads differently from the first pair of I/O pads;

operating in the second mode, comprising:

equally biasing the first pair of I/O pads and the second pair of I/O pads;

wherein the receiver and transmitter share the first pair of the I/O pads and the second pair of I/O pads.

11. The method according to claim 10 , wherein equally biasing the first pair of I/O pads and the second pair of I/O pads comprises selectively operating a first switching device to connect the first and second pairs of I/O pads to a same voltage.

12. The method according to claim 10 , wherein biasing the second pair of I/O pads differently from the first pair of I/O pads comprises:

selectively operating a first switching device to connect the first pair of I/O pads to first voltage; and

selectively operating a second switching device to connect the second pair of I/O pads to a second voltage.

13. The method according to claim 12 , wherein the first and second voltages are less than 3.0 volts.

14. The method according to claim 10 , wherein the first mode is a high-speed mode and the second mode is a power-saving mode.

15. A system, comprising:

a host device connected to a sink device via an interface circuit, wherein the interface circuit comprises:

a channel comprising:

a first pair of I/O pads arranged at a first end of the channel; and

a second pair of I/O pads arranged at a second end of the channel;

a first resistance circuit connected to the first pair of I/O pads;

a second resistance circuit connected to the second pair of I/O pads; and

a first switching circuit connected to the first pair of I/O pads via the first resistance circuit and configured to selectively bias the first pair of I/O pads according to a plurality of voltages.

16. The system according to claim 15 , wherein:

the first resistance circuit comprises:

a first resistive element connected to a second I/O pad from the first pair of I/O pads and

a second resistive element connected to a first I/O pad from the first pair of I/O pads; and

the second resistance circuit comprises:

a third resistive element connected to a first I/O pad from the second pair of I/O pads; and

a fourth resistive element connected to a second I/O pad from the second pair of I/O pads.

17. The system according to claim 15 , wherein the channel comprises a uni-directional redriver circuit.

18. The system according to claim 15 , wherein the channel comprises a bi-directional redriver circuit comprising a transmitter connected in parallel with a receiver, wherein the transmitter and receiver share the first and second pairs of I/O pads.

19. The system according to claim 15 , further comprising a second switching circuit connected to the second pair of I/O pads via the second resistance circuit and configured to selectively bias the second pair of I/O pads according to the plurality of voltages.

20. The system according to claim 15 , wherein each voltage from the plurality of voltages is less than 3.0 volts.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 054090, FRAME 0617 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →
SECURITY INTEREST Recorded Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2019
From: KHAN. P, ATHAR ALI; VISWKARMA, MANISH KUMAR
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 051149/0458 →
Priority Claims (1)
IN 201811022324 · Jun 14, 2018 · national
Continuity (2)
Continuation 16283951 · Feb 25, 2019
Related Publication 20200106644A1 · Apr 2, 2020