Flexible press fit pins for semiconductor packages and related methods
Implementations of pins for semiconductor packages may include: an upper contact portion having a contact surface coupled with a pin receiver; a lower portion having a vertical stop and at least two curved legs; a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface, and; a gap between a bottom contact surface of the vertical stop and the upper contact surface of the horizontal base.
1. A pin for a semiconductor package, comprising:
an upper portion;
a lower portion comprising a single vertical stop, the lower portion further comprising at least two curved portions, each curved portion comprising a c-shape;
a horizontal base coupled directly to the at least two curved portions and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate; and
a gap between the single vertical stop and an upper contact surface of the horizontal base.
2. The pin of claim 1 , wherein the single vertical stop is between the at least two curved portions.
3. The pin of claim 1 , wherein the single vertical stop is configured to stop movement of the pin when the single vertical stop contacts the upper contact surface.
4. The pin of claim 1 , wherein the upper portion comprises a deformable portion configured to deform along a direction substantially perpendicular with a longest length of the pin in response to inserting the upper portion into a pin receiver.
5. The pin of claim 1 , wherein the pin comprises a plurality of stops extending substantially perpendicular to a longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from a pin receiver.
6. The pin of claim 1 , wherein a gap is present between curves of the at least two curved portions.
7. The pin of claim 1 , wherein each of the curves of the at least two curved portions are substantially parallel.
8. A pin for a semiconductor package, comprising:
an upper portion;
a lower portion comprising a single vertical stop, the lower portion further comprising at least two curved portions, each curved portion comprising an s-shape;
a horizontal base coupled directly to the at least two curved portions and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate; and
a gap between the single vertical stop and an upper contact surface of the horizontal base.
9. The pin of claim 8 , wherein a first section of each of the two curved portions is collinear with a longest length of the pin.
10. The pin of claim 8 , wherein a second section of each of the two curved portions is coupled to the horizontal base through a bend comprising an angle between 60 and 120 degrees.
11. The pin of claim 8 , wherein the at least two curved portions are configured to flex to allow the single vertical stop to move toward the upper contact surface in response to a pressure applied to the pin along a direction collinear with a longest length of the pin toward the upper contact surface.
12. The pin of claim 8 , wherein the at least two curved portions are configured to stop flexing after the at least two curved portions have bent sufficiently to allow the single vertical stop to contact the upper contact surface.
13. The pin of claim 8 , wherein the upper portion comprises a deformable portion configured to deform along a direction substantially perpendicular with a longest length of the pin in response to inserting the upper portion into a pin receiver.
14. The pin of claim 8 , wherein the pin comprises a plurality of stops extending perpendicularly to a longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from a pin receiver.
15. A pin for a semiconductor package, comprising:
an upper portion;
a lower portion comprising a single vertical stop, the lower portion further comprising at least two curved portions, each curved portion comprising one of an s-shape or a c-shape;
a horizontal base coupled directly to the at least two curved portions and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate; and
a gap between the single vertical stop and an upper contact surface of the horizontal base;
wherein each of the at least two curved portions further comprise a tapered portion coupled directly with the horizontal base.
16. The pin of claim 15 , wherein the single vertical stop is between the at least two curved portions.
17. The pin of claim 15 , wherein a second portion of each of the at least two curved portions is coupled to the horizontal base through a bend comprising an angle between 60 and 90 degrees.
18. The pin of claim 15 , wherein the single vertical stop is configured to stop movement of the pin when the single vertical stop contacts the upper contact surface.
19. The pin of claim 15 , wherein the upper portion comprises a deformable portion configured to deform along a direction substantially perpendicular with a longest length of the pin in response to inserting the upper portion into a pin receiver.
20. The pin of claim 15 , wherein the pin comprises a plurality of stops extending perpendicularly to a longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from a pin receiver.