IP Library Granted Patent US 11,043,517
Granted Patent B2
US 11,043,517 · App. 16/892,615 · Granted Jun 22, 2021

Semiconductor crystal substrate, infrared detector, method for producing semiconductor crystal substrate, and method for producing infrared detector

Inventors: Shigekazu Okumura (Setagaya, JP); Shuichi Tomabechi (Atsugi, JP); Ryo Suzuki (Fujisawa, JP)
Assignee: FUJITSU LIMITED
H01L27/1443H01L21/02395H01L21/02398H01L21/02466H01L21/02507H01L21/02549H01L21/02576H01L21/02579H01L21/02631H01L27/1446H01L31/03046H01L31/035236H01L31/1844
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Quick Facts
Patent No.
US 11,043,517
App. No.
16/892,615
Granted
Jun 22, 2021
Kind
B2
Abstract

A semiconductor crystal substrate includes a crystal substrate that is formed of a material including one of GaSb and InAs, a first buffer layer that is formed on the crystal substrate and formed of a material including GaSb, and a second buffer layer that is formed on the first buffer layer and formed of a material including GaSb. The first buffer layer has a p-type conductivity, and the second buffer layer has an n-type conductivity.

Claims (18)

1. A method of producing a semiconductor crystal substrate, the method comprising:

forming a first buffer layer on a crystal layer by molecular beam epitaxy with a material including GaSb, the crystal layer being formed of a material including one of GaSb and InAs, a composition ratio of Ga in the first buffer layer being greater than a composition ratio of Sb in the first buffer layer, and the first buffer layer having a p-type conductivity; and

forming a second buffer layer on the first buffer layer by molecular beam epitaxy with a material including GaSb, a composition ratio of Sb in the second buffer layer being greater than a composition ratio of Ga in the second buffer layer, and the second buffer layer having an n-type conductivity, wherein

the first buffer layer is formed at a substrate temperature greater than or equal to 470° C. and less than or equal to 550° C.; and

the second buffer layer is formed at a substrate temperature greater than or equal to 420° C. and less than or equal to 460° C.

2. The method as claimed in claim 1 , wherein the first buffer layer is formed at a substrate temperature greater than or equal to 500° C. and less than or equal to 550° C.

3. The method as claimed in claim 1 , wherein the molecular beam epitaxy is solid source molecular beam epitaxy.

4. The method as claimed in claim 1 , wherein

the first buffer layer is formed of the material including GaSb and one or both of In and As; and

the second buffer layer is formed of the material including GaSb and one or both of In and As.

5. A method of producing an infrared detector, the method comprising:

forming a first contact layer having the n-type or p-type conductivity on the second buffer layer of the semiconductor crystal substrate produced by the method of claim 1 ;

forming an infrared absorption layer having a superlattice structure on the first contact layer; and

forming a second contact layer having the other of the n-type or the p-type conductivity on the infrared absorption layer.

6. The method as claimed in claim 5 , wherein

the first contact layer is p-type, and the first contact layer is formed of a material including GaSb;

the infrared absorption layer having the superlattice structure is formed by alternately stacking a GaSb layer and an InAs layer; and

the second contact layer is n-type, and the second contact layer is formed of a material including InAs.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
Priority Claims (1)
JP JP2016-116470 · Jun 10, 2016 · national
Continuity (2)
Division 15486671 · Apr 13, 2017
Related Publication 20200295059A1 · Sep 17, 2020