High voltage extended drain MOSFET (EDMOS) devices in a high-k metal gate (HKMG)
The present disclosure relates to semiconductor devices, and more particularly, to high voltage extended drain MOSFET (EDMOS) devices in a high-k metal gate (HKMG) and methods of manufacture. A structure of the present disclosure includes a plurality of extended drain MOSFET (EDMOS) devices on a high voltage well with a split-gate dielectric material including a first gate dielectric material and a second gate dielectric material, the second gate dielectric material including a thinner thickness than the first gate dielectric material, and a high-k dielectric material on the split-gate dielectric material.
1. A structure, comprising:
a plurality of extended drain MOSFET (EDMOS) devices on a high voltage well with a split-gate dielectric material comprising a first gate dielectric material and a second gate dielectric material, the second gate dielectric material comprising a thinner thickness than the first gate dielectric material; and
a high-k dielectric material on the split-gate dielectric material.
2. The structure of claim 1 , further comprising a plurality of high-k metal gate (HKMG) platform devices which includes the high-k dielectric material and at least one channel material.
3. The structure of claim 2 , wherein the second gate dielectric material is on the HKMG platform devices and the at least one channel material comprises silicon germanium (SiGe).
4. The structure of claim 3 , wherein the first gate dielectric material comprises a high voltage gate oxide and the second gate dielectric material comprises another gate oxide which is on the high voltage gate oxide.
5. The structure of claim 2 , wherein the at least one channel material comprising SiGe includes a first SiGe channel formed in a first PFET device and a second SiGe channel formed in a second PFET device.
6. The structure of claim 5 , wherein the first gate dielectric material and the second gate dielectric material are part of the plurality of EDMOS devices, and the EDMOS devices comprise a n-EDMOS device and a p-EDMOS device.
7. The structure of claim 6 , wherein the high-k dielectric material is on the second gate dielectric material and a portion of the plurality of high-k metal gate (HKMG) platform devices is devoid of the first gate dielectric material and the second gate dielectric material.
8. The structure of claim 7 , further comprising:
a plurality of work function metals on the first gate dielectric material, the second gate dielectric material, and the high-k material; and
a plurality of gates over the first gate dielectric material, the second gate dielectric material, and the high-k dielectric material.
9. The structure of claim 8 , wherein the split gate dielectric material comprises a stepped feature between the first gate dielectric material and the second gate dielectric material.
10. The structure of claim 1 , wherein the high voltage well comprises a n-well and a p-well.
11. The structure of claim 1 , wherein the first gate dielectric material has a thickness in a range of 250 Å to 350 Å, and the second gate dielectric material has a thickness in the range of 30 Å to 70 Å.
12. A structure, comprising:
a n-type extended drain MOSFET (n-EDMOS) device in an integrated circuit which includes a high-k dielectric material, a high voltage gate oxide, and another gate oxide;
a p-type extended drain MOSFET (p-EDMOS) device in the integrated circuit which includes the high-k dielectric material, the high voltage gate oxide, and the another gate oxide;
a plurality of high-k metal gate (HKMG) platform devices with the high-k dielectric material, the another gate oxide, and a channel material in the integrated circuit; and
a stepped feature between the high voltage gate oxide and the another gate oxide.
13. The structure of claim 12 , wherein the another gate oxide is a part of the HKMG platform devices and the channel material comprises silicon germanium (SiGe).
14. The structure of claim 13 , wherein the channel material comprises a first SiGe channel formed in a first PFET device and a second SiGe channel formed in a second PFET device.
15. The structure of claim 14 , wherein the another gate oxide is on the high voltage gate oxide.
16. The structure of claim 15 , wherein the high-k dielectric material is on the another gate oxide.
17. The structure of claim 12 , wherein the high voltage gate oxide has a thickness in a range of 250 Å to 350 Å.
18. The structure of claim 17 , wherein the another gate oxide has the thickness in the range of 30 Å to 70 Å.
19. The structure of claim 12 , further comprising:
a plurality of work function metals on the high voltage gate oxide, the another gate oxide, and the high-k dielectric material; and
a plurality of gates over the high voltage gate oxide, the another gate oxide, and the high-k dielectric material.
20. A method, comprising:
forming a high voltage well in a semiconductor material;
forming extended drain MOSFET (EDMOS) devices on the high voltage well with a split-gate oxide comprising a first gate oxide and a second gate oxide which has a thinner thickness than the first gate oxide; and
forming high-k metal gate (HKMG) platform devices with a high-k dielectric material and at least one channel comprising silicon germanium (SiGe) comprising at least one of a thin oxide and a thick oxide in complementary metal-oxide-semiconductor (CMOS) field effect transistors.