IP Library Granted Patent US 11,204,463
Granted Patent B1
US 11,204,463 · App. 16/931,771 · Granted Dec 21, 2021

Integrated circuit structure with optical absorber layer over optical grating coupler

Inventors: Benjamin V. Fasano (New Windsor, NY); Andreas D. Stricker (Essex Junction, VT); Hanyi Ding (Colchester, VT); Yusheng Bian (Ballston Lake, NY); Bo Peng (Sharon, MA)
Assignee: GlobalFoundries U.S. Inc.
G02B6/1225G02B2006/12061G02B2006/12073G02B2006/12107G02B2006/12126
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Quick Facts
Patent No.
US 11,204,463
App. No.
16/931,771
Granted
Dec 21, 2021
Kind
B1
Abstract

Embodiments of the disclosure provide an integrated circuit (IC) structure, including an optical medium for light signals; and an optical grating coupler coupled to the optical medium. The optical grating coupler is configured to reorient light from the optical medium. A cladding material is over the optical grating coupler. An absorber layer is over the cladding material, and vertically above the optical grating coupler.

Claims (33)

1. An integrated circuit (IC) structure, comprising:

an optical medium for light signals;

an optical grating coupler coupled to the optical medium, wherein the optical grating coupler is configured to reorient light from the optical medium;

a cladding material over the optical grating coupler; and

an absorber layer over the cladding material, and vertically above the optical grating coupler.

2. The IC structure of claim 1 , wherein the optical medium comprises an optical tap between the optical medium and a silicon waveguide (SWG) structure.

3. The IC structure of claim 1 , wherein the optical medium laterally terminates within the cladding material beneath the optical grating coupler.

4. The IC structure of claim 1 , wherein the absorber layer includes a material having a refractive index of at least approximately 1.5.

5. The IC structure of claim 4 , wherein the material includes an epoxy.

6. The IC structure of claim 1 , wherein the cladding material includes a dielectric material on a substrate, wherein a portion of the dielectric material is vertically between the substrate and the optical medium.

7. The IC structure of claim 1 , wherein the optical medium includes silicon, and wherein the optical grating coupler includes polycrystalline silicon.

8. The IC structure of claim 1 , wherein the optical medium is coupled to an intermediate optical element having a u-shaped bend between two device components.

9. An integrated circuit (IC) structure, comprising:

an optical medium for light signals;

an optical grating coupler coupled to the optical medium, wherein the optical grating coupler is configured to reorient light from the optical medium;

a cladding material over the optical grating coupler; and

an absorber layer above the optical grating coupler and the cladding material, wherein at least a portion of the cladding material is vertically above the optical grating coupler.

10. The IC structure of claim 9 , wherein a thickness of the portion of the cladding material between the optical grating coupler and the absorber layer is at least approximately 1.0 micrometers.

11. The IC structure of claim 9 , wherein an upper surface of the absorber layer is substantially coplanar with an upper surface of a back end of line stack above the optical grating coupler.

12. The IC structure of claim 9 , wherein the optical medium comprises an optical tap between the optical medium and a silicon waveguide (SWG) structure.

13. The IC structure of claim 12 , wherein the optical medium laterally terminates within the cladding material beneath the optical grating coupler.

14. The IC structure of claim 9 , wherein the absorber layer includes a material having a refractive index of at least approximately 1.5.

15. The IC structure of claim 9 , further comprising the absorber layer and a metal wire within an insulator layer, wherein the absorber layer is above the optical grating coupler.

16. The IC structure of claim 9 , wherein the optical medium is coupled to an intermediate optical element having a u-shaped bend between two device components.

17. An integrated circuit (IC) structure, comprising:

a substrate;

a cladding material over the substrate, wherein the cladding material includes a dielectric material;

an optical medium configured to carry light signals, and embedded within the cladding material between an upper surface and a lower surface of the cladding material;

an optical grating coupler coupled to the optical medium, wherein the optical grating coupler is configured to reorient light from the optical medium through the cladding material;

an absorber layer on the cladding material and above the optical grating coupler, wherein least a portion of the cladding material is vertically between the optical grating coupler and the absorber layer.

18. The IC structure of claim 17 , wherein an upper surface of the absorber layer is substantially coplanar with an upper surface of a back end of line stack above the cladding material.

19. The IC structure of claim 17 , wherein the absorber layer includes an epoxy having a refractive index of at least approximately 1.5.

20. The IC structure of claim 17 , wherein the optical medium includes an optical tap coupled to an intermediate optical element having a u-shaped bend between two device components.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2020
From: FASANO, BENJAMIN V.; STRICKER, ANDREAS D.; DING, HANYI; BIAN, YUSHENG; PENG, BO
To: GLOBALFOUNDRIES INC.
Reel/Frame 053239/0931 →