IP Library Granted Patent US 12,080,739
Granted Patent B2
US 12,080,739 · App. 17/029,682 · Granted Sep 3, 2024

Global shutter sensor systems and related methods

Inventors: Manuel H. Innocent (Wezemaal, BE); Tomas Geurts (Haasrode, BE); David T. Price (Gresham, OR)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01L27/14623H01L27/1461H01L27/1463H01L27/14643H01L27/14689
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Quick Facts
Patent No.
US 12,080,739
App. No.
17/029,682
Granted
Sep 3, 2024
Kind
B2
Abstract

Implementations of a semiconductor device may include a photodiode included in a second epitaxial layer of a semiconductor substrate; light shield coupled over the photodiode; and a first epitaxial layer located in one or more openings in the light shield. The first epitaxial layer and the second epitaxial layer may form a single crystal.

Claims (33)

1. A semiconductor device comprising:

a photodiode comprised in a second epitaxial layer of a semiconductor substrate;

a light shield coupled over the photodiode; and

a first epitaxial layer located in one or more openings in the light shield;

wherein the first epitaxial layer and the second epitaxial layer form a single crystal.

2. The device of claim 1 , wherein the photodiode is a deep photodiode.

3. The device of claim 1 , wherein the light shield is comprised of a dielectric and a metal.

4. The device of claim 3 , wherein the metal of the light shield is encapsulated in an oxide.

5. The device of claim 1 , further comprising a memory element comprised in the first epitaxial layer.

6. The device of claim 1 , further comprising a vertical transfer gate electrically and physically coupled with the photodiode.

7. The device of claim 2 , further comprising a shallow photodiode electrically and mechanically coupled with the deep photodiode, wherein a width of the shallow photodiode is less than a width of the deep photodiode.

8. A semiconductor device comprising:

a first epitaxial layer comprising in-pixel circuits and a plurality of shallow photodiodes;

an opaque light shield formed on the first epitaxial layer, the opaque light shield comprising one or more openings; and

a second epitaxial layer located in the one or more openings in the opaque light shield, the second epitaxial layer comprising a plurality of deep photodiodes;

wherein the first epitaxial layer is coupled over a surface of the opaque light shield facing a front side of the semiconductor device.

9. The device of claim 8 , wherein the opaque light shield is recessed in the second epitaxial layer.

10. The device of claim 8 , wherein the first epitaxial layer and the second epitaxial layer are a single crystal.

11. The device of claim 8 , wherein the in-pixel circuits comprise one or more of a storage gate, a storage diode, and a storage capacitor.

12. The device of claim 8 , further comprising a vertical transfer gate electrically and physically coupled with the plurality of deep photodiodes.

13. The device of claim 8 , wherein the plurality of shallow photodiodes is electrically and physically coupled with the plurality of deep photodiodes.

14. The device of claim 8 , wherein the opaque light shield is between a portion of the first epitaxial layer and a portion of the second epitaxial layer, wherein the portion of the first epitaxial layer is directly over the portion of the second epitaxial layer.

15. The device of claim 8 , wherein a width of an entire shallow photodiode of the plurality of shallow photodiodes is less than a width of a deep photodiode of the plurality of deep photodiodes and wherein the width of the entire shallow photodiode fits within a width of an opening of the one or more openings in the opaque light shield.

16. A semiconductor device comprising:

a photodiode comprised in a second epitaxial layer of a semiconductor substrate;

a light shield coupled over the photodiode; and

a first epitaxial layer coupled over the light shield;

wherein the first epitaxial layer and the second epitaxial layer form a single crystal; and

wherein the light shield is between the first epitaxial layer and the second epitaxial layer.

17. The device of claim 16 , wherein the photodiode is a deep photodiode.

18. The device of claim 16 , wherein the light shield is comprised of a dielectric and a metal.

19. The device of claim 16 , further comprising a vertical transfer gate electrically and physically coupled with the photodiode.

20. The device of claim 16 , wherein the first epitaxial layer comprises a shallow photodiode, wherein a width of the shallow photodiode is less than a width of the photodiode.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 054523, FRAME 0378 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →
SECURITY INTEREST Recorded Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2020
From: INNOCENT, MANUEL H.; GEURTS, TOMAS; PRICE, DAVID T.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053861/0010 →