Plasma die singulation systems and related methods

1. A method of singulating a plurality of die comprised in a substrate, the method comprising:

exposing a substrate material of a substrate in a die street through removing a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed;

singulating a plurality of die comprised in the substrate through plasma etching the exposed substrate material of the substrate in the die street;

wherein the portion of the substrate material in the die street and the metal layer are removed substantially simultaneously; and

wherein the substrate is less than 30 micrometers thick.

2. The method of claim 1 , wherein removing the metal layer in the die street further comprises removing through one of sawing, lasering, scribing, or jet ablating.

3. The method of claim 2 , further comprising removing damage from a sidewall of the die street through the plasma etching.

4. The method of claim 1 , wherein exposing the substrate further comprises removing a passivation layer coupled over the metal layer.

5. The method of claim 1 , wherein singulating the plurality of die comprised in the substrate through plasma etching further comprises removing a portion of the substrate material of the substrate having a width less than a width of the die street.

6. The method of claim 1 , wherein the portion of the substrate material removed extends between 5 to 15 micrometers into the substrate.

7. A method of singulating a plurality of die comprised in a substrate, the method comprising:

exposing a substrate material of a substrate in a die street through removing a passivation layer and a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed; and

singulating a plurality of die comprised in the substrate through plasma etching the exposed substrate material of the substrate in the die street;

wherein the portion of the substrate material in the die street, the passivation layer, and the metal layer are removed substantially simultaneously.

8. The method of claim 7 , wherein removing the metal layer in the die street further comprises removing through one of sawing, lasering, scribing, or jet ablating.

9. The method of claim 7 , further comprising removing damage from a sidewall of the die street through the plasma etching.

10. A method of singulating a plurality of die comprised in a substrate, the method comprising:

exposing a substrate material of a substrate in a die street through removing a passivation layer and a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed; and

singulating a plurality of die comprised in the substrate through plasma etching the exposed substrate material of the substrate in the die street;

wherein the portion of the substrate material in the die street, the passivation layer, and the metal layer are removed substantially simultaneously; and

wherein the portion of the substrate material removed extends between 5 to 15 micrometers into the substrate.

11. The method of claim 10 , wherein removing the passivation layer and the metal layer in the die street further comprises removing through one of sawing, lasering, scribing, or jet ablating.

12. The method of claim 10 , wherein singulating the plurality of die comprised in the substrate through plasma etching further comprises removing a portion of the substrate material of the substrate having a width less than a width of the die street.

13. The method of claim 10 , further comprising removing damage from a sidewall of the die street through the plasma etching.

14. The method of claim 10 , wherein the substrate is less than 30 micrometers thick.