IP Library Granted Patent US 11,536,588
Granted Patent B2
US 11,536,588 · App. 17/035,983 · Granted Dec 27, 2022

Inductive position sensor with integrated fault detection

Inventors: Pavel Baros (Zastavka u Brna, CZ); Michal Olsak (Sokolnice, CZ)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
G01D5/2006G01D5/2073
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Quick Facts
Patent No.
US 11,536,588
App. No.
17/035,983
Granted
Dec 27, 2022
Kind
B2
Abstract

An integrated circuit is provided for use in a sensor system having a plurality of sensing coils arranged in a star configuration coupled to terminals of an integrated circuit, such that a first and a second terminal are connected external to the integrated circuit via a loop including a first and a second sensing coil in the plurality of sensing coils. The integrated circuit includes: sensing circuitry for evaluation of sense signals received from the sensing coils via said terminals; a current source and a current sink coupled to respectively a first and a second of said terminals, such that upon supply of current from the current source a current is established through the loop external to the integrated circuit and a detection signal is generated; and an evaluator for evaluating one of more detection signals to detect failure and/or weakness within said loop.

Claims (31)

1. A sensor system comprising a plurality of sensing coils arranged in a star configuration on a first side of each sensing coil, each of the sensing coils having a second side coupled to terminals of an integrated circuit, such that a first and a second terminal are connected external to the integrated circuit via a loop including a first and a second sensing coil in the plurality of sensing coils, the integrated circuit including:

sensing circuitry for evaluation of sense signals received from the sensing coils via said terminals;

a current source and a current sink coupled to respectively a first and a second of said terminals, such that upon supply of current from the current source a current is established through the loop external to the integrated circuit and a detection signal is generated;

an evaluator for evaluating one or more detection signals to detect failure and/or weakness within said loop.

2. The sensor system as claimed in claim 1 , wherein the current source and the current sink are each coupled to said first and second terminal respectively.

3. The sensor system as claimed in claim 1 , wherein the sensing circuitry comprises an amplifier, an analog-to-digital converter, and a microcontroller that implements the evaluator as an application specific finite state machine.

4. The sensor system as claimed in claim 3 , wherein the sensing circuitry further comprises a rectifier upstream of the analog-to-digital converter, wherein the sensing circuitry is configured for disabling and/or bypassing said rectifier during receipt of a detection signal.

5. The sensor system as claimed in claim 1 , wherein the evaluator is coupled to the terminals via a test path comprising a multiplexer, an amplifier, and an analog-to-digital converter, said test path being arranged in parallel to the sensing circuitry.

6. The sensor system as claimed in claim 1 , wherein each of said terminals is connected to a bias circuit.

7. The sensor system as claimed in claim 1 , further comprising an excitation coil, and wherein the sensing coils are shifted relative to each other by a predefined angle, wherein a movable inductive coupling element is arranged so as to define a magnitude of inductance between the excitation coil and the sensing coils on the basis of the movable inductive coupling element's position relative to the sensing coils.

8. The sensor system as claimed in claim 7 , wherein the excitation coil is driven by a driving signal originating from an oscillator within the integrated circuit.

9. The sensor system as claimed in claim 1 , wherein the evaluator is configured for detecting an open connection in the loop and a weakened connection in the input loop relative to a proper connection in the loop.

10. The sensor system as claimed in claim 1 , wherein a digital signal processor that is part of the sensing circuitry is configured for the provision of a control signal to enable the current source and optionally to set any switches between the current source and a selected terminal.

11. An integrated circuit for use in a sensor system having a plurality of sensing coils arranged in a star configuration on a first side of each sensing coil, each of the sensing coils having a second side coupled to terminals of an integrated circuit, such that a first and a second terminal are connected external to the integrated circuit via a loop including a first and a second sensing coil in the plurality of sensing coils, the integrated circuit comprising:

sensing circuitry for evaluation of sense signals received from the sensing coils via said terminals;

a current source and a current sink coupled to respectively a first and a second of said terminals, such that upon supply of current from the current source a current is established through the loop external to the integrated circuit and a detection signal is generated;

an evaluator for evaluating one or more detection signals to detect failure and/or weakness within said loop.

12. The integrated circuit as claimed in claim 11 , wherein the current source and the current sink are coupled to said first and second terminal respectively.

13. The integrated circuit as claimed in claim 11 , wherein the sensing circuitry comprises an amplifier, an analog-to-digital converter, and a microcontroller that implements the evaluator as an application specific finite state machine.

14. The integrated circuit as claimed in claim 13 , wherein the sensing circuitry further comprises a rectifier upstream of the analog-to-digital converter, wherein the sensing circuitry is configured for disabling and/or bypassing said rectifier during receipt of a detection signal.

15. The integrated circuit as claimed in claim 11 , wherein the evaluator is coupled to the terminals via a test path comprising a multiplexer, an amplifier, and an analog-to-digital converter, said test path being arranged in parallel to the sensing circuitry.

16. The integrated circuit as claimed in claim 11 , wherein each of said terminals is connected to a bias circuit.

17. A method for detection of an open or weakened connection in an inductive sensor system having a plurality of sensing coils arranged in a star configuration on a first side of each sensing coil, each of the sensing coils having a second side coupled to terminals of an integrated circuit, such that a first and a second terminal are connected external to the integrated circuit via a first loop including a first and a second sensing coil, the second terminal is connected to a third terminal via a second loop including the second sensing coil and a third sensing coil, and the third terminal is connected to the first terminal via a third loop including the first and third sensing coils, the method comprising:

applying a current through said first, second, and third loops to obtain first, second, and third detection signals;

verifying that the first, second, and third detection signals match each other or a predetermined value to evaluate a status of connections in said plurality of sensing coils.

18. The method of claim 17 , wherein said applying includes coupling each possible pair of the first, second, and third terminals to a matched current source and current sink.

19. The method as claimed in claim 17 , wherein the one or more detection signals are amplified and converted from analog to digital prior to their evaluation.

20. The method as claimed in claim 17 , further comprising:

driving an excitation coil of the inductive sensor system;

receiving sense signals resulting from excitation of said excitation coil via one or more of the sensing coils; and

processing said sense signals to evaluate a position of the inductive sensor system or one or more parts thereof.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 054523, FRAME 0378 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →
SECURITY INTEREST Recorded Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2020
From: BAROS, PAVEL; OLSAK, MICHAL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 053912/0964 →