Systems and methods for integrated shielding in a current sensor
Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.
1. A current sensor comprising:
a conductor;
a first die having a first surface proximal to the conductor and a second opposing surface distal from the conductor, wherein the first die comprises:
a substrate having first and second opposing surfaces;
a shield layer having a first surface proximal to the second surface of the substrate and having a second opposing surface;
a protective layer having a first surface proximal to the second surface of the shield layer and having a second opposing surface, wherein the first surface of the protective layer has an aperture; and
a bond pad in contact with the shield layer and disposed in the aperture in the protective layer; and
a second die having a first surface proximal to the first die and a second opposing surface distal from the first die and supporting a magnetic field sensing circuit, wherein the conductor, the first die, and the second die are vertically aligned with the first die positioned between the conductor and the second die.
2. The current sensor of claim 1 , wherein the first die further comprises a first insulation layer having a first surface proximal to the second surface of the substrate and having a second opposing surface.
3. The current sensor of claim 1 , wherein the current sensor is provided in the form of an integrated circuit having a lead frame, wherein the conductor comprises a first portion of the lead frame and a plurality of signal leads comprise a second portion of the lead frame and wherein the current sensor further comprises a wire bond coupled between the bond pad and at least one of the signal leads.
4. The current sensor of claim 1 , wherein the substrate is at least one of a semiconductor substrate or an insulating substrate.
5. The current sensor of claim 4 , wherein the substrate is a semiconductor substrate comprising silicon.
6. The current sensor of claim 4 , wherein the substrate is an insulating substrate comprising Alumina or glass.
7. The current sensor of claim 2 , wherein the first insulation layer comprises silicon oxide, silicon dioxide, or a combination thereof.
8. The current sensor of claim 1 , wherein the shield layer comprises conductive material.
9. The current sensor of claim 1 , wherein the protective layer comprises benzo-cyclobutene (BCB) or a polymer dielectric material.
10. The current sensor of claim 1 , wherein the magnetic field sensing circuit comprises a magnetic field sensing element comprising at least one of a Hall-effect element or a magnetoresistance element.
11. The current sensor of claim 2 , wherein the first die further comprises a second insulation layer disposed between the conductor and the substrate.
12. The current of sensor of claim 2 , wherein the first insulation layer comprises one or more layers of insulation.
13. The current sensor of claim 11 , wherein the second insulation layer comprises a flex circuit having a layer of Kapton® and a metalized layer.
14. The current sensor of claim 11 , wherein the second insulation layer comprises at least one of a polymer dielectric material or a layer of adhesive.
15. The current sensor of claim 1 , wherein the first die has a first length between a first edge of the first surface of the first die and a second, opposing edge of the first surface of the first die, wherein the first length is larger than a length of the conductor so that at least one of the first or second edge of the first die extends beyond an edge of the conductor.
16. The current sensor of claim 1 , wherein the first die has a first length between a first edge of the first surface of the first die and a second, opposing edge of the first surface of the first die, the second die has a second length between a first edge of the first surface of the second die and second, opposing edge of the first surface of the second die, and wherein the first length is larger than the second length so that at least one of the first or second edge of the first die extends beyond the first or second edge of the second die.
17. The current sensor of claim 1 , wherein the first die has a first length between a first edge of the first surface of the first die and a second, opposing edge of the first surface of the first die and wherein the shield layer does not extend to at least one of the first or second edge of the first die.
18. The current sensor of claim 17 , wherein the current sensor is provided in the form of an integrated circuit having a lead frame, wherein the conductor comprises a first portion of the lead frame and a plurality of signal leads comprise a second portion of the lead frame, and wherein at least one edge of the first die extends beyond an edge of at least one of the signal leads.