Current sensor package
Current sensor packages are described including a leadframe configured to carry a current to be sensed and a current sensor that is electrically isolated from the leadframe. The current sensor is disposed adjacent to a first portion of the leadframe that includes a plurality of notches. An encapsulating material is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is adjacent to the current sensor and includes the plurality of notches. The current sensor includes a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate. The first magnetic field sensing element and the second magnetic field sensing element are disposed on opposite sides of a central axis of the first portion of the leadframe.
1. An apparatus, comprising:
a leadframe configured to carry a current to be sensed;
a current sensor that is electrically isolated from the leadframe, the current sensor being disposed adjacent to a first portion of the leadframe, the first portion including a plurality of notches that are formed therein, the current sensor including a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate, the first magnetic field sensing element and the second magnetic field sensing element being disposed on opposite sides of a central axis of the first portion of the leadframe and configured to sense the current; and
an encapsulating material that is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is adjacent to the current sensor and includes the plurality of notches,
wherein the first portion of the leadframe is disposed between a second portion of the leadframe and a third portion of the leadframe, the first portion of the leadframe is formed in a same plane as the second portion of the leadframe and the third portion of the leadframe, and the first portion extends at an angle relative to the second portion and the third portion.
2. The apparatus of claim 1 , wherein the current sensor includes a coreless current sensor.
3. The apparatus of claim 1 , wherein the first magnetic field sensing element includes a first Hall effect element and the second magnetic field sensing element includes a second Hall effect element.
4. The apparatus of claim 1 , wherein the current sensor is separated from the first portion of the leadframe by a layer of insulating material.
5. The apparatus of claim 1 , wherein the substrate is disposed above or below the plurality of notches.
6. The apparatus of claim 1 , wherein the first portion of the leadframe includes a through-hole, and the current sensor is disposed above or below the through-hole.
7. The apparatus of claim 1 , wherein:
the plurality of notches includes a first notch and a second notch that are formed on opposite sides of a central axis of the first portion of the leadframe,
and
the current sensor is disposed above or below the first portion.
8. The apparatus of claim 1 , wherein the first portion of the leadframe includes a through-hole and the current sensor is inserted in the through-hole.
9. The apparatus of claim 1 , wherein:
the plurality of notches includes a first notch and a second notch that are formed on opposite sides of the first portion of the leadframe and extend beyond the central axis of the first portion of the leadframe, and
the current sensor is disposed above or below the first portion.
10. The apparatus of claim 1 , wherein the first portion of the leadframe includes a through-hole that is formed therein.
11. An apparatus, comprising:
a leadframe having a first portion, a second portion, and a third portion, the first portion of the leadframe being contiguous with respect to the second portion of the leadframe and the third portion of the leadframe, the first portion of the leadframe being disposed between the second portion of the leadframe and the third portion of the leadframe and configured to carry a current between the second portion and the third portion, the first potion, the second potion, and the third portion of the leadframe being defined by a first notch and a second notch that are formed on opposite sides of the leadframe, the first notch and the second notch being so shaped as to cause the first portion in the leadframe to extend at an angle relative to the second portion of the leadframe and the third portion of the leadframe;
a current sensor that is electrically isolated from the leadframe, the current sensor being disposed above or below the first portion of the leadframe; and
an encapsulating material that is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is situated directly above or below the current sensor.
12. The apparatus of claim 11 , wherein the current sensor includes a differential current sensor having a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate, the first magnetic field sensing element and the second magnetic field sensing element being disposed on opposite sides of a central axis of the first portion of the leadframe.
13. The apparatus of claim 11 , wherein:
the first notch and the second notch cause the first portion to have a smaller width than at least one of the first portion and the second potion, and
the current sensor is disposed above or below the first portion.
14. An apparatus, comprising:
a leadframe having a first portion, a second portion, and a third portion, the first portion of the leadframe being disposed between the second portion of the leadframe and the third portion of the leadframe, the first portion including a through-hole that is formed therein;
a current sensor that is electrically isolated from the leadframe; and
an encapsulating material that is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that includes the through-hole,
wherein the leadframe includes a first notch and a second notch that are formed on opposite sides of the leadframe, and
wherein the first notch and the second notch are so shaped as to cause the first portion to extend at an angle relative to the second portion and the third portion of the leadframe.
15. The apparatus of claim 14 , wherein the current sensor includes a differential current sensor having a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate, the first magnetic field sensing element and the second magnetic field sensing element being disposed on opposite sides of a central axis of the leadframe.
16. The apparatus of claim 14 , wherein the current sensor is disposed above or below the first portion.
17. The apparatus of claim 14 , wherein the current sensor is disposed in the through-hole.
18. The apparatus of claim 14 , wherein the first notch and the second notch are further arranged to cause the first portion to have a smaller width than at least one of the first portion and the second portion, and the current sensor is disposed above or below the first portion.
19. A method, comprising:
providing a leadframe having a first portion, a second portion, and a third portion, the first portion of the leadframe being contiguous with respect to the second portion of the leadframe and the third portion of the leadframe, the first portion ofthe leadframe being disposed between the second portion of the leadframe and the third portion of the leadframe and configured to carry a current between the second portion and the third portion, the first portion of the leadframe being disposed at a non-zero angle relative to at least one of the second portion of the leadframe and the third portion of the leadframe, the first port of the leadframe being formed in a same plane as the second portion of the leadframe and the third portion of the leadframe;
providing a current sensor that is electrically isolated from the leadframe, the current sensor being disposed above or below the first portion of the leadframe; and
encapsulating the current sensor and at least a part of the first portion of the leadframe that is situated directly above or below the current sensor in encapsulating material.
20. The method of claim 19 , wherein the first portion of the leadframe includes a notch.
21. The method of claim 19 , wherein the first portion of the leadframe includes a through-hole.
22. The method of claim 19 , wherein the first portion of the leadframe is defined by a plurality of notches that are formed in the leadframe.
23. The method of claim 19 , wherein the current sensor includes a differential current sensor having a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate, the first magnetic field sensing element and the second magnetic field sensing element being disposed on opposite sides of a central axis of the first portion of the leadframe.