Electronic apparatus, cooling device, and method for manufacturing cooling device
An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.
1. An electronic apparatus comprising: a chassis; a heat generating element in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, wherein the cooling device is in the chassis, wherein the heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; a heat dissipating section that dissipates the heat absorbed by the heat absorbing section to the cooling fin; and a thin plate section at an end portion that is on an opposite side from the heat dissipating section, and has a thickness which is smaller than that of the heat absorbing section, and the pressing assembly has: a base assembly fixed to the chassis; and a bridge section that is integral with the base assembly and is on a surface of the thin plate section to thereby extend over the heat pipe; wherein a first surface of the heat pipe is higher than a second surface of the heat pipe, thereby the thin plate section is thinner than the heat absorbing section, the bridge section is on a surface of a first surface side of the thin plate section, a surface of the bridge section is flush with or lower than the first surface of the heat pipe wherein the pressing assembly further has a second bridge section that sandwiches the heat absorbing section between itself and the bridge section, and extends over the heat pipe.
2. The electronic apparatus according to claim 1 ,
wherein the second surface is connected to the heat generating element, and the first surface opposes an inner surface of the chassis.
3. The electronic apparatus according to claim 1 , wherein the second bridge section is on the second surface of the heat pipe.
4. The electronic apparatus according to claim 3 ,
wherein the thin plate section is at a position not overlapping the heat generating element.