Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus
A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.
1. A heat dissipation structure for a heat-generating electric component, comprising:
a heat dissipator disposed along a surface of the electric component; and
a porous material held between the electric component and the heat dissipator, wherein
the porous material being impregnated with heat-transfer fluid, and
the porous material includes a metal material, and includes nickel at least on the surface.
2. The heat dissipation structure according to claim 1 , wherein
the heat-transfer fluid includes liquid metal.
3. The heat dissipation structure according to claim 1 , wherein
the porous material includes a mesh.
4. The heat dissipation structure according to claim 1 , wherein
the porous material includes a sponge.
5. The heat dissipation structure according to claim 1 , further comprising
a board and a semiconductor chip mounted on the board, wherein
the semiconductor chip includes a substrate and a die, and
the electric component includes the die.
6. An electronic apparatus comprising the heat dissipation structure according to claim 1 .
7. A method for manufacturing a heat dissipation structure for a heat-generating electric component, comprising:
an impregnation step of impregnating a porous material with heat-transfer fluid;
a placing step of placing the porous material impregnated with the heat-transfer fluid on a surface of the electric component; and
a holding step of bringing a heat dissipator into contact with the porous material and holding the porous material between the heat dissipator and the electric component, wherein
the porous material includes a metal material, and includes nickel at least on the surface.
8. The method for manufacturing a heat dissipation structure according to claim 7 , further comprising:
prior to the placing step, a step of applying the heat-transfer fluid to the surface of the electric component.
9. The method for manufacturing a heat dissipation structure according to claim 7 , further comprising:
prior to the holding step, a step of applying the heat-transfer fluid to the surface of the heat dissipator.
10. A heat dissipation structure for a heat-generating electric component, comprising:
a board and a semiconductor chip mounted on the board;
a heat dissipator disposed along a surface of the electric component; and
a porous material held between the electric component and the heat dissipator, wherein
the porous material being impregnated with heat-transfer fluid,
the semiconductor chip includes a substrate and a die, and
the electric component includes the die.
11. A method for manufacturing a heat dissipation structure for a heat-generating electric component on a board, comprising:
an impregnation step of impregnating a porous material with heat-transfer fluid;
a placing step of placing the porous material impregnated with the heat-transfer fluid on a surface of the electric component; and
a holding step of bringing a heat dissipator into contact with the porous material and holding the porous material between the heat dissipator and the electric component, wherein
a semiconductor chip is mounted on the board,
the semiconductor chip includes a substrate and a die, and
the electric component includes the die.