Patent Assignment
Reel/Frame 062398/0488
Assignment of Assignor's Interest
Recorded: 2023-01-17
Pages: 7
Assignors
WATANABE, RYOTA
Executed: 2022-12-03
KITAMURA, MASAHIRO
Executed: 2022-12-04
ITOYAMA, MIZUKI
Executed: 2022-12-05
KAMIMURA, TAKUROH
Executed: 2022-12-04
ZHOU, JUNRONG
Executed: 2022-12-04
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Heat Dissipation Structure, Method for Manufacturing Heat Dissipation Structure, and Electronic Apparatus