Heat pipe for improved thermal performance at cold plate interface
Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.
1. A thermal exchange assembly comprising:
a cold plate configured to be directly coupled to a semiconductor device, the cold plate including a first window section that comprises a recessed or depressed portion of the cold plate and has a first window section depth that is a portion of a thickness of the cold plate; and
a heat pipe (HP) that is a separate structure from the cold plate, the HP being directly coupled to the cold plate,
wherein the HP includes a second window section that comprises a recessed or depressed portion of the HP and has a second window section depth that is a portion of a thickness of the HP,
wherein the second window section of the HP is disposed on the first window section, and
wherein a cavity is formed by the first window section depth and the second window section depth and comprises a space formed between the portion of the thickness of the cold plate and the portion of the thickness of the HP.
2. The thermal exchange assembly of claim 1 , further comprising:
a wick structure disposed within the cavity.
3. The thermal exchange assembly of claim 2 , wherein the wick structure extends from inside the HP and out of the second window section, and attaches to the first window section of the cold plate.
4. The thermal exchange assembly of claim 2 , wherein the wick structure is a first wick structure, and the HP includes a second wick structure separate from the first wick structure.
5. The thermal exchange assembly of claim 4 , wherein the second wick structure extends from inside the HP and out of the second window section and is attached to a top portion of the first wick structure, and
wherein a bottom portion of the first wick structure is attached to the first window section of the cold plate.
6. The thermal exchange assembly of claim 2 , wherein the wick structure extends in a longitudinal direction that is perpendicular to a direction of the thickness of the cold plate and a direction of the thickness of the HP.
7. The thermal exchange assembly of claim 1 , further comprising:
a pedestal section disposed inside the second window section.
8. The thermal exchange assembly of claim 1 , wherein the second window section comprises a plurality of fins, each fin of the plurality of fins extending vertically from the second window section and being laterally separated from other fins of the plurality of fins,
wherein a plurality of slots are arranged between each fin of the plurality of fins, and
wherein the plurality of fins are oriented longitudinally with respect to the HP.
9. The thermal exchange assembly of claim 1 , wherein the second window section comprises a plurality of holes extending vertically into the HP.
10. The thermal exchange assembly of claim 1 , wherein:
the cold plate comprises a plurality of pins extending vertically from the cold plate,
each pin of the plurality of pins includes a hole in a center portion thereof, and
the hole in the center portion of each pin has a circular or elliptical shaped opening.
11. The thermal exchange assembly of claim 1 , wherein the cold plate comprises a plurality of holes extending vertically into the cold plate.
12. The thermal exchange assembly of claim 11 , wherein the cold plate comprises a plurality of pins extending vertically from the cold plate.
13. The thermal exchange assembly of claim 1 , wherein the thermal exchange assembly further comprises:
attachment springs configured to mount the thermal exchange assembly in a chassis of a computing system.
14. The thermal exchange assembly of claim 1 , wherein the cold plate is formed of copper, a copper alloy, aluminum, or an aluminum alloy.
15. The thermal exchange assembly of claim 1 , wherein the HP is formed from copper, a copper alloy, aluminum, an aluminum alloy, epoxy-impregnated carbon fiber, or graphene.
16. The thermal exchange assembly of claim 1 , wherein the second window section comprises a plurality of fins, each fin of the plurality of fins extending vertically from the second window section and being laterally separated from other fins of the plurality of fins,
wherein a plurality of slots are arranged between each fin of the plurality of fins, and
wherein the plurality of fins are oriented diagonally with respect to the HP.
17. The thermal exchange assembly of claim 1 , wherein the second window section comprises a plurality of fins oriented in a longitudinal direction that is perpendicular to a direction of the thickness of the cold plate and a direction of the thickness of the HP.