IP Library › Assignment 054698/0486
Patent Assignment
Reel/Frame 054698/0486

Assignment of Assignor's Interest

Recorded: 2020-12-18 Pages: 7
Assignors
PAAVOLA, JUHA
Executed: 2020-12-17
MISHRA, COLUMBIA
Executed: 2020-12-17
HUTTULA, JUSTIN
Executed: 2020-12-17
CARBONE, MARK
Executed: 2020-12-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Heat Pipe for Improved Thermal Performance at Cold Plate Interface
Application: 17/127,355 →
Publication: US 2021/0136956