Heat radiating structure and electronic apparatus
A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.
1 . A heat radiating structure of an electric component which generates heat, comprising:
a porous material which abuts on a surface of the electric component; and
a heat radiating element which includes a recessed part into which the porous material fits, wherein the heat radiating element sandwiches and holds the porous material between the heat radiating element itself and the surface of the electric component, wherein
the porous material includes:
a heat generating element abutment range part into which a heat transfer fluid is impregnated and which abuts on the surface of the electric component and receives heat from the electric component, and
a heat generating element non-abutment range part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the electric component, and
the heat generating element non-abutment range part is fixedly adhered to the heat radiating element with a belt-shaped adhesive material;
wherein the belt-shaped adhesive material is a sponge and fills a gap between the heat radiating element and a substrate around the electronic component.
2 . The heat radiating structure according to claim 1 , wherein
the heat generating element non-abutment range part protrudes from the heat generating element abutment range part and a plurality of the heat generating element non-abutment range parts is at symmetrical positions, and
the belt-shaped adhesive material crosses the heat generating element non-abutment range parts.
3 . The heat radiating structure according to claim 1 , further comprising:
a baseplate; and
a semiconductor chip mounted on the baseplate, wherein
the semiconductor chip includes the substrate and a die and
the electric component is the die.
4 . The heat radiating structure according to claim 1 , wherein
the heat-transfer liquid is a liquid metal.
5 . The heat radiating structure according to claim 1 , wherein
the porous material is a mesh.
6 . The heat radiating structure according to claim 1 , wherein
the porous material is a metal material and at least a surface of the porous material is made of nickel.
7 . An electronic apparatus which has a heat radiating structure comprising:
an electric component which generates heat;
a porous material which abuts on a surface of the electric component; and
a heat radiating element which includes a recessed part into which the porous material fits, wherein the heat radiating element sandwiches and holds the porous material between the heat radiating element itself and the surface of the electric component, wherein
the porous material includes:
a heat generating element abutment range part into which a heat transfer fluid is impregnated and which abuts on the surface of the electric component and receives heat from the electric component, and
a heat generating element non-abutment range part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the electric component, and
the heat generating element non-abutment range part is fixedly adhered to the heat radiating element with a belt-shaped adhesive material;
wherein the belt-shaped adhesive material is a sponge and fills a gap between the heat radiating element and a substrate around the electronic component.