Solid metal foam thermal interface material
Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.
1. A semiconductor assembly, comprising:
a heat generating device;
a heat transferring device; and
a solid alloy bonding the heat generating device to the heat transferring device, wherein the solid alloy is formed by:
applying a thermal interface material (TIM) between the heat generating device and the heat transferring device such that a first surface of the TIM is in touching relation with a surface of the heat generating device, and a second surface of the TIM opposite the first surface is in touching relation with a surface of the heat transferring device, wherein:
the TIM comprises a solid metal foam and a first liquid metal;
the solid metal foam comprises one or more interstitial porous areas extending from a first surface of the solid metal foam through a second surface of the solid metal foam opposite the first surface of the solid metal foam; and
the TIM is applied by placing the solid metal foam such that a first surface of the solid metal foam is in touching relation with the surface of the heat generating device, and applying the first liquid metal on the first surface of the solid metal foam such that a portion of the first liquid metal diffuses through the one or more interstitial porous areas and onto the surface of the heat generating device; and
compressing the TIM to form the solid alloy from the TIM.
2. The semiconductor assembly of claim 1 , wherein the heat generating device is a semiconductor die, and the heat transferring device is a semiconductor package lid or heat sink.
3. The semiconductor assembly of claim 1 , wherein the solid metal foam comprises indium or an indium alloy.
4. The semiconductor assembly of claim 3 , wherein the first liquid metal comprises gallium; gallium and indium; gallium, indium, and tin; gallium, indium, tin, and zinc; or mixtures thereof.
5. The semiconductor assembly of claim 4 , wherein the first liquid metal is a liquid metal foam comprising gas bubbles.
6. The semiconductor assembly of claim 1 , wherein after compression, the density of the solid metal foam increases to a level less than the density of a metal or metal alloy from which the solid metal foam was formed.
7. The semiconductor assembly of claim 1 , wherein:
the TIM further comprises a second liquid metal; and
applying the TIM between the heat generating device and the heat transferring device further comprises:
applying the second liquid metal between the heat generating device and the solid metal foam.
8. The semiconductor assembly of claim 1 , wherein:
the solid metal foam further comprises one or more additional interstitial porous areas extending through the first surface of the solid metal foam but not through the second surface of the solid metal foam; and
applying the TIM between the heat generating device and the heat transferring device further comprises:
applying the first liquid metal over the first surface of the solid metal foam such that the first liquid metal partially or fully fills the one or more additional interstitial porous areas.
9. The semiconductor assembly of claim 8 , wherein the one or more additional interstitial porous areas comprise an oxide or coating to contain the first liquid metal.
10. The semiconductor assembly of claim 8 , wherein:
during compression, the first liquid metal alloys to the one or more additional interstitial porous areas; and
the solid alloy has a higher viscosity than the solid metal foam.
11. A semiconductor assembly, comprising:
a first heat transferring device;
a second heat transferring device; and
a solid alloy bonding the first heat transferring device to the second heat transferring device, wherein the solid alloy is formed by:
applying a thermal interface material (TIM) between the first heat transferring device and the second heat transferring device such that a first surface of the TIM is in touching relation with a surface of the first heat transferring device, and a second surface of the TIM opposite the first surface is in touching relation with a surface of the second heat transferring device, wherein:
the TIM comprises a solid metal foam and a first liquid metal;
the solid metal foam comprises one or more interstitial porous areas extending from a first surface of the solid metal foam through a second surface of the solid metal foam opposite the first surface of the solid metal foam; and
the TIM is applied by placing the solid metal foam such that a first surface of the solid metal foam is in touching relation with the surface of the first heat transferring device, and applying the first liquid metal on the first surface of the solid metal foam such that a portion of the first liquid metal diffuses through the one or more interstitial porous areas and onto the surface of the first heat transferring device; and
compressing the TIM to form the solid alloy from the TIM.
12. The semiconductor assembly of claim 11 , wherein the first heat transferring device is a semiconductor package lid; and the second heat transferring device is a heat sink.
13. The semiconductor assembly of claim 11 , wherein the solid metal foam comprises indium or an indium alloy.
14. The semiconductor assembly of claim 13 , wherein the first liquid metal comprises gallium; gallium and indium; gallium, indium, and tin; gallium, indium, tin, and zinc; or mixtures thereof.
15. The semiconductor assembly of claim 14 , wherein the first liquid metal is a liquid metal foam comprising gas bubbles.
16. The semiconductor assembly of claim 11 , wherein after compression, the density of the solid metal foam increases to a level less than the density of a metal or metal alloy from which the solid metal foam was formed.