Integrated circuit assemblies having metal foam structures

1. An integrated circuit assembly, comprising:

an electronic substrate;

at least one integrated circuit device electrically attached to the electronic substrate;

a heat dissipation device;

a thermal interface material between the at least one integrated circuit device and the heat dissipation device; and

a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material.

2. The integrated circuit assembly of claim 1 , further comprising a stiffener attached to the electronic substrate, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

3. The integrated circuit assembly of claim 1 , wherein the metal foam comprises a solid metal matrix having a plurality of cells.

4. The integrated circuit assembly of claim 1 , wherein the metal foam comprises a non-metallic matrix having a plurality of cells and a metal coated on the non-metallic matrix.

5. The integrated circuit assembly of claim 1 , wherein the at least one integrated circuit device comprises a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface of the at least one integrated circuit device, and wherein the metal foam contacts the at least one side of the at least one integrated circuit.

6. The integrated circuit assembly of claim 1 , wherein the heat dissipation device includes a main body having a first surface and a boundary wall extending from the first surface of the main body of the heat dissipation device, and wherein the boundary wall is attached to the electronic substrate.

7. The integrated circuit assembly of claim 1 , wherein the metal foam is open cell.

8. The integrated circuit assembly of claim 1 , wherein the metal foam is closed cell.

9. An electronic system, comprising:

a housing;

a motherboard disposed within the housing;

an integrated circuit assembly electrically attached to a first surface of the motherboard, wherein the integrated circuit assembly comprises:

an electronic substrate;

at least one integrated circuit device electrically attached to the electronic substrate;

a heat dissipation device;

a thermal interface material between the at least one integrated circuit device and the heat dissipation device; and

a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material.

10. The electronic system of claim 9 , further comprising a stiffener attached to the electronic substrate, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

11. The electronic system of claim 9 , wherein the metal foam comprises a solid metal matrix having a plurality of cells.

12. The electronic system of claim 9 , wherein the metal foam comprises a non-metallic matrix having a plurality of cells and a metal coated on the non-metallic matrix.

13. The electronic system of claim 9 , wherein the at least one integrated circuit device comprises a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface of the at least one integrated circuit device, and wherein the metal foam contacts the at least one side of the at least one integrated circuit.

14. The electronic system of claim 9 , wherein the heat dissipation device includes a main body having a first surface and a boundary wall extending from the first surface of the main body of the heat dissipation device, and wherein the boundary wall is attached to the electronic substrate.

15. A method of fabricating an integrated circuit assembly, comprising:

forming an electronic substrate;

electrically attaching at least one integrated circuit device to the electronic substrate;

forming a heat dissipation device;

thermally attaching the heat dissipation device to the at least one integrated circuit device with a thermal interface material; and

forming a metal foam to surround the at least one integrated circuit device and contact the thermal interface material.

16. The method of claim 15 , further comprising attaching a stiffener to the electronic substrate, and wherein forming the metal foam further comprises disposing the metal foam between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

17. The method of claim 15 , wherein forming the metal foam comprises forming a solid metal matrix having a plurality of cells.

18. The method of claim 15 , wherein forming the metal foam comprises forming a non-metallic matrix having a plurality of cells and a metal coated on the non-metallic matrix.

19. The method of claim 15 , wherein forming the at least one integrated circuit device comprises forming the at least one integrated circuit device having a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface of the at least one integrated circuit device, and further comprising contacting the metal foam with the at least one side of the at least one integrated circuit.

20. The method of claim 15 , wherein forming the heat dissipation device includes forming a main body having a first surface and forming a boundary wall extending from the first surface of the main body of the heat dissipation device, and attaching the boundary wall to the electronic substrate.